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1مؤتمر
المؤلفون: Yen-Ju Lee, Yen-Fu Su, Tuan-Yu Hung, Kuo-Ning Chiang
المصدر: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International. :299-302 Oct, 2012
Relation: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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2مؤتمر
المؤلفون: Chan-Yen Chou, Tuan-Yu Hung, Ming-Chih Yew, Wen-Kun Yang, Dyi-Chung Hu, Mon-Chin Tsai, Ching-Shun Huang, Kuo-Ning Chiang
المصدر: EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. :1-6 Apr, 2008
Relation: 2008 Intl. Conf. on Thermal, Mechanical & Multi-Physics simulation and Experiments in Microelectronics
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3
المؤلفون: Kuo-Ning Chiang, Kai-Chiang Wu, Tuan-Yu Hung, Si-Yun Lin
المصدر: IEEE Transactions on Device and Materials Reliability. 15:437-442
مصطلحات موضوعية: Materials science, business.industry, Temperature cycling, Test method, Structural engineering, Strain rate, Electronic, Optical and Magnetic Materials, Stress (mechanics), Creep, Soldering, Electrical and Electronic Engineering, Deformation (engineering), Safety, Risk, Reliability and Quality, business, Joint (geology)
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4
المؤلفون: Wei Li, Kuo-Ning Chiang, Tuan-Yu Hung, Chun-Kai Liu, Li-Ling Liao, Ming-Ji Dai
المصدر: Microelectronic Engineering. 120:114-120
مصطلحات موضوعية: Materials science, Nuclear engineering, Current crowding, Insulated-gate bipolar transistor, Condensed Matter Physics, Electromigration, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Reliability (semiconductor), Power module, Forensic engineering, Power semiconductor device, Electrical and Electronic Engineering, Joule heating, Current density
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5
المؤلفون: W. H. Chi, Li-Ling Liao, Tuan-Yu Hung, Chin-Chun Wang, Kuo-Ning Chiang
المصدر: IEEE Transactions on Device and Materials Reliability. 14:484-492
مصطلحات موضوعية: Wire bonding, Materials science, business.industry, Current crowding, Structural engineering, Electronic, Optical and Magnetic Materials, Power (physics), Power module, Power electronics, Power cycling, Junction temperature, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, business, Joule heating
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6
المؤلفون: Keng-Cheng Lu, Kuo-Ning Chiang, Chin-Chun Wang, Chao-Jen Huang, Chang-Chun Lee, Tuan-Yu Hung
المصدر: Microelectronic Engineering. 107:125-129
مصطلحات موضوعية: Materials science, Strain energy density function, Temperature cycling, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Reliability (semiconductor), Power module, Soldering, Power cycling, Forensic engineering, Growth rate, Electrical and Electronic Engineering, Composite material, Cycling
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7
المؤلفون: Kuo-Ning Chiang, Chang-Chun Lee, Tuan-Yu Hung, Yen-Fu Su, Shin-Yueh Yang
المصدر: Microelectronics Reliability. 52:794-803
مصطلحات موضوعية: Engineering, Incandescent light bulb, business.industry, Energy conversion efficiency, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, Power (physics), Energy conservation, law, Thermal, Optoelectronics, Junction temperature, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, business, Light-emitting diode, Diode
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8
المؤلفون: Chin-Hsiu Huang, Tuan-Yu Hung, Shih-Ying Chiang, Kuo-Ning Chiang, Chang-Chun Lee
المصدر: Microelectronics Reliability. 51:1819-1823
مصطلحات موضوعية: Engineering, Wire bonding, business.industry, Thermal resistance, Electrical engineering, Condensed Matter Physics, Chip, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Infrared thermometer, Power module, Power cycling, Shear stress, Junction temperature, Electrical and Electronic Engineering, Composite material, Safety, Risk, Reliability and Quality, business
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9
المؤلفون: Kuo-Ning Chiang, Chan-Yen Chou, Chao-Jen Huang, Tuan-Yu Hung
المصدر: IEEE Transactions on Advanced Packaging. 33:681-689
مصطلحات موضوعية: Engineering, Computer simulation, business.industry, Electronic packaging, Structural engineering, Electrical and Electronic Engineering, business, Failure mode and effects analysis, Drop test, Durability, Wafer-level packaging, Finite element method, Drop impact
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10
المؤلفون: Kuo-Ning Chiang, Chan-Yen Chou, Ming-Chih Yew, Wen-Kun Yang, Tuan-Yu Hung, Shin-Yueh Yang
المصدر: Microelectronics Reliability. 48:1149-1154
مصطلحات موضوعية: Engineering, Computer simulation, business.industry, Electronic packaging, Mechanical engineering, Condensed Matter Physics, Drop test, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Drop impact, Reliability (semiconductor), Chip-scale package, Soldering, Electronic engineering, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, business, Wafer-level packaging