المؤلفون: Yen-Ju Lee, Yen-Fu Su, Tuan-Yu Hung, Kuo-Ning Chiang

المصدر: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International. :299-302 Oct, 2012

Relation: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Chan-Yen Chou, Tuan-Yu Hung, Ming-Chih Yew, Wen-Kun Yang, Dyi-Chung Hu, Mon-Chin Tsai, Ching-Shun Huang, Kuo-Ning Chiang

المصدر: EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. :1-6 Apr, 2008

Relation: 2008 Intl. Conf. on Thermal, Mechanical & Multi-Physics simulation and Experiments in Microelectronics

المؤلفون: Kuo-Ning Chiang, Kai-Chiang Wu, Tuan-Yu Hung, Si-Yun Lin

المصدر: IEEE Transactions on Device and Materials Reliability. 15:437-442

مصطلحات موضوعية: Materials science, business.industry, Temperature cycling, Test method, Structural engineering, Strain rate, Electronic, Optical and Magnetic Materials, Stress (mechanics), Creep, Soldering, Electrical and Electronic Engineering, Deformation (engineering), Safety, Risk, Reliability and Quality, business, Joint (geology)

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cc4349bccd69cc040fa4fd4363b791da
https://doi.org/10.1109/tdmr.2015.2462726

المؤلفون: Wei Li, Kuo-Ning Chiang, Tuan-Yu Hung, Chun-Kai Liu, Li-Ling Liao, Ming-Ji Dai

المصدر: Microelectronic Engineering. 120:114-120

مصطلحات موضوعية: Materials science, Nuclear engineering, Current crowding, Insulated-gate bipolar transistor, Condensed Matter Physics, Electromigration, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Reliability (semiconductor), Power module, Forensic engineering, Power semiconductor device, Electrical and Electronic Engineering, Joule heating, Current density

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8eb0a07d9f5e3144268a07d622054e1d
https://doi.org/10.1016/j.mee.2013.12.033

المؤلفون: W. H. Chi, Li-Ling Liao, Tuan-Yu Hung, Chin-Chun Wang, Kuo-Ning Chiang

المصدر: IEEE Transactions on Device and Materials Reliability. 14:484-492

مصطلحات موضوعية: Wire bonding, Materials science, business.industry, Current crowding, Structural engineering, Electronic, Optical and Magnetic Materials, Power (physics), Power module, Power electronics, Power cycling, Junction temperature, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, business, Joule heating

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9daac1c4d3d4e7456530ff25bba46419
https://doi.org/10.1109/tdmr.2013.2288703

المؤلفون: Keng-Cheng Lu, Kuo-Ning Chiang, Chin-Chun Wang, Chao-Jen Huang, Chang-Chun Lee, Tuan-Yu Hung

المصدر: Microelectronic Engineering. 107:125-129

مصطلحات موضوعية: Materials science, Strain energy density function, Temperature cycling, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Reliability (semiconductor), Power module, Soldering, Power cycling, Forensic engineering, Growth rate, Electrical and Electronic Engineering, Composite material, Cycling

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0e550d16d4e46e5fcd783b973e58db5d
https://doi.org/10.1016/j.mee.2012.09.014

المؤلفون: Kuo-Ning Chiang, Chang-Chun Lee, Tuan-Yu Hung, Yen-Fu Su, Shin-Yueh Yang

المصدر: Microelectronics Reliability. 52:794-803

مصطلحات موضوعية: Engineering, Incandescent light bulb, business.industry, Energy conversion efficiency, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, Power (physics), Energy conservation, law, Thermal, Optoelectronics, Junction temperature, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, business, Light-emitting diode, Diode

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c50bb3470bc4a7ef2a991e95476e9758
https://doi.org/10.1016/j.microrel.2011.07.059

المؤلفون: Chin-Hsiu Huang, Tuan-Yu Hung, Shih-Ying Chiang, Kuo-Ning Chiang, Chang-Chun Lee

المصدر: Microelectronics Reliability. 51:1819-1823

مصطلحات موضوعية: Engineering, Wire bonding, business.industry, Thermal resistance, Electrical engineering, Condensed Matter Physics, Chip, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Infrared thermometer, Power module, Power cycling, Shear stress, Junction temperature, Electrical and Electronic Engineering, Composite material, Safety, Risk, Reliability and Quality, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::470112d4d8eb02422b5ffeed685eb4a9
https://doi.org/10.1016/j.microrel.2011.06.048

المؤلفون: Kuo-Ning Chiang, Chan-Yen Chou, Chao-Jen Huang, Tuan-Yu Hung

المصدر: IEEE Transactions on Advanced Packaging. 33:681-689

مصطلحات موضوعية: Engineering, Computer simulation, business.industry, Electronic packaging, Structural engineering, Electrical and Electronic Engineering, business, Failure mode and effects analysis, Drop test, Durability, Wafer-level packaging, Finite element method, Drop impact

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::92a9ad95bca2cd22d5f864c52c6b771e
https://doi.org/10.1109/tadvp.2010.2042447

المؤلفون: Kuo-Ning Chiang, Chan-Yen Chou, Ming-Chih Yew, Wen-Kun Yang, Tuan-Yu Hung, Shin-Yueh Yang

المصدر: Microelectronics Reliability. 48:1149-1154

مصطلحات موضوعية: Engineering, Computer simulation, business.industry, Electronic packaging, Mechanical engineering, Condensed Matter Physics, Drop test, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Drop impact, Reliability (semiconductor), Chip-scale package, Soldering, Electronic engineering, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, business, Wafer-level packaging

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2bfd85bf47d0515cbdb01e2862fc453a
https://doi.org/10.1016/j.microrel.2008.06.024