المؤلفون: Khan, W.T., Sitaraman, S., Vera, A. L., Pulugurtha, M. R., Sundaram, V., Tummala, R. R., Papapolymerou, J.

المصدر: 2015 European Microwave Conference (EuMC) Microwave Conference (EuMC), 2015 European. :618-621 Sep, 2015

Relation: 2015 European Microwave Conference (EuMC 2015)

المؤلفون: Liu, X., Chen, Q., Sundaram, V., Simmons-Matthews, M., Wachtler, K. P., Tummala, R. R., Sitaraman, S. K.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 12(2):263-271 Jun, 2012

المؤلفون: Zhang, X., Rajoo, R., Selvanayagam, C. S., Kumar, A., Rao, V. S., Khan, N., Kripesh, V., Lau, J. H., Kwong, D.-L., Sundaram, V., Tummala, R. R.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 2(6):935-943 Jun, 2012

المؤلفون: Wang, F., Liu, F., Kong, L., Sundaram, V., Tummala, R. R., Adibi, A.

المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 33(4):876-882 Nov, 2010

المؤلفون: Aggarwal, A. O., Raj, P. M., Lee, B.-W., Yim, M. J., Iyer, M., Wong, C. P., Tummala, R. R.

المصدر: IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 31(4):341-354 Oct, 2008

المؤلفون: Lee, B.-W., Tsai, J.-Y., Jin, H., Yoon, C. K., Tummala, R. R.

المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 31(2):367-376 May, 2008

المؤلفون: Rajoo, R., Lim, S. S., Wong, E. H., Hnin, W. Y., Seah, S. K. W., Tay, A. A. O., Iyer, M., Tummala, R. R.

المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 31(2):377-385 May, 2008

المؤلفون: Huang, Z. R., Guidotti, D., Wan, L., Chang, Y.-J., Yu, J., Liu, J., Kuo, H.-F., Chang, G.-K., Liu, F., Tummala, R. R.

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 30(4):708-715 Dec, 2007

المؤلفون: Kumbhat, N., Raj, P. M., Pucha, R. V., Tsai, J.-Y., Atmur, S., Bongio, E., Sitaraman, S. K., Tummala, R. R.

المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 30(4):641-653 Nov, 2007

المؤلفون: Aggarwal, A. O., Abothu, I. R., Raj, P. M., Sacks, M. D., Tummala, R. R.

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 30(3):486-493 Sep, 2007