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المؤلفون: Chao-Wei Liu, Ming-Hung Chen, Tun-Ching Pi, Jen-Chieh Kao, Yung-I Yeh
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d218d8128ab8070a6f354236fb075dd7
https://doi.org/10.1109/ectc51906.2022.00161 -
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المؤلفون: Jen-Chieh Kao, Chao-Wei Liu, Chang-Lin Yeh, Shang-Lin Wu, Tun-Ching Pi, Ming-Hung Chen
المصدر: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
مصطلحات موضوعية: System in package, Materials science, visual_art, Ball size, Electronic component, Miniaturization, Ball (bearing), visual_art.visual_art_medium, Geometry, Lower cost, Solder ball, Grinding
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::43909b3ff0bee62d891b4171b9bd43b6
https://doi.org/10.1109/eurosime48426.2020.9152667