المؤلفون: Sun, J., Li, J., Shang, Z., Wang, G., Cheng, R., Huang, Q., Li, L., Sun, Y., Yan, P., Qu, J.

المصدر: IEEE Journal of Selected Topics in Quantum Electronics IEEE J. Select. Topics Quantum Electron. Selected Topics in Quantum Electronics, IEEE Journal of. 30(4: Adv. Mod. and Int. beyond Si and InP-based Plt.):1-7 Aug, 2024

المؤلفون: Varshney, Kanupriya, Shukla, Prajjwal, Prakash, Bhanu, Das, Devarshi Mrinal, Rawat, Brajesh

المصدر: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2024 8th IEEE. :1-3 Mar, 2024

Relation: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

المؤلفون: Varshney, Kanupriya, Yadav, Mani S., Das, Devarshi Mrinal, Rawat, Brajesh

المصدر: 2024 37th International Conference on VLSI Design and 2024 23rd International Conference on Embedded Systems (VLSID) VLSID VLSI Design and 2024 23rd International Conference on Embedded Systems (VLSID), 2024 37th International Conference on. :414-418 Jan, 2024

Relation: 2024 37th International Conference on VLSI Design and 2024 23rd International Conference on Embedded Systems (VLSID)

المؤلفون: Shen, Y., Gao, J., Guo, Z., Liu, Y., Tian, H.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 45(1):88-91 Jan, 2024

المؤلفون: Zhou, You, Wang, Sheng, Xin, Sichen, Wang, Yuhang, Li, Zhenyu, Zaghloul, Mona

المصدر: 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS) Circuits and Systems (MWSCAS), 2023 IEEE 66th International Midwest Symposium on. :308-311 Aug, 2023

Relation: 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS)

المؤلفون: Ye, Changqing, Liu, Dongming, Shen, Junhao, Bi, Hengchang, Wu, Xing, Wang, Chaolun

المصدر: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-4 Jul, 2023

Relation: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Huo, Dianhong, Choi, Jungwook

المصدر: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) Solid-State Sensors, Actuators and Microsystems (Transducers), 2023 22nd International Conference on. :1368-1371 Jun, 2023

Relation: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)

المؤلفون: Dong, Zhi-Qi, Hu, Kai-Ming, Deng, Xin-Lu, Xin, Yi-Hang, He, You-Lang, Ye, Jing-Lin

المصدر: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) Solid-State Sensors, Actuators and Microsystems (Transducers), 2023 22nd International Conference on. :1946-1949 Jun, 2023

Relation: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)

المؤلفون: Zhao, Ye, Yang, Ruilong^{Aff1, Aff2, IDs1227402468553_cor2}, Yang, Ke, Dou, Jiarui, Yang, Xiaoting, Guo, Jinzhong, Zhou, Guowei^{Aff1, Aff2}, Xu, Xiaohong^{Aff1, Aff2, IDs1227402468553_cor8}

المصدر: Nano Research. :1-7

المؤلفون: Xia, Fengtian, Wang, Dongbo^{Aff1, IDs4084302329413_cor2}, Cao, Jiamu^{Aff2, IDs4084302329413_cor3}, Zeng, Zhi, Zhang, Bingke, Pan, Jingwen, Liu, Donghao, Liu, Sihang, Zhao, Chenchen, Jiao, Shujie, Chen, Tianyuan, Liu, Gang^{Aff3, IDs4084302329413_cor12}, Fang, Xuan^{Aff4, IDs4084302329413_cor13}, Zhao, Liancheng, Wang, Jinzhong^{Aff1, IDs4084302329413_cor15}

المصدر: Science China Materials. 67(7):2293-2301