المؤلفون: Nakamura, T., Nakagawa, M.

المصدر: 2017 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2017 International Conference on. :443-446 Apr, 2017

Relation: 2017 International Conference on Electronics Packaging (ICEP)

المؤلفون: Uchida, T., Moro, M., Hiwasa, S., Taniguchi, J.

المصدر: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on. :422-427 Apr, 2015

Relation: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

المؤلفون: Wei, Jiang, Nan, Wang, Wei, Yan, Song, Hu, Xiao-Qiong, Pu

المصدر: 2013 International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), 2013 International Conference on. :337-342 Aug, 2013

Relation: 2013 International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)

المؤلفون: Du, Jun, Wei, Zhengying, He, Wei, Tang, Yiping

المصدر: 2011 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems Nano/Micro Engineered and Molecular Systems (NEMS), 2011 IEEE International Conference on. :792-795 Feb, 2011

Relation: 2011 IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

المؤلفون: Karolina Milenko, Firehun Tsige Dullo, Paul C. V. Thrane, Zeljko Skokic, Christopher A. Dirdal

المصدر: Nanomaterials, Vol 13, Iss 10, p 1598 (2023)

مصطلحات موضوعية: surface-enhanced Raman scattering (SERS), Raman spectroscopy, UV-nanoimprint lithography (UV-NIL), nanopatterning, sensors, Chemistry, QD1-999

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2079-4991/13/10/1598; https://doaj.org/toc/2079-4991

URL الوصول: https://doaj.org/article/cb4755a624c349b497eda56960f3ce64

المؤلفون: Thomas Handte, Nicolas Scheller, Lars Dittrich, Manuel W. Thesen, Martin Messerschmidt, Stefan Sinzinger

المصدر: Micro and Nano Engineering, Vol 14, Iss , Pp 100106- (2022)

مصطلحات موضوعية: Soft UV-NIL, Nanofabrication, High etch selectivity, Bilayer, Trilayer, Lift-off, Electronics, TK7800-8360, Technology (General), T1-995

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S259000722200003X; https://doaj.org/toc/2590-0072

URL الوصول: https://doaj.org/article/9b428cc5db3f496590bbfc3141358aa6

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المؤلفون: Xiaoli Li, Qingkang Wang, Jun Shen, Yanbo Liu, Zhaoying Zhu, Yongzhong Wan, Xiaoming Niu

المصدر: 2008 2nd IEEE International Nanoelectronics Conference Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International. :415-421 Mar, 2008

Relation: 2008 2nd IEEE International Nanoelectronics Conference (NEC)

المؤلفون: Yanbo Liu, Xiaoli Li, Weimin Zhou, Xiaoming Niu, Zhitang Song, Min Guoquan, Bo Liu, Gaoming Feng, Cheng Xu, Yongzhong Wan, Jing Zhang

المصدر: 2008 2nd IEEE International Nanoelectronics Conference Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International. :807-810 Mar, 2008

Relation: 2008 2nd IEEE International Nanoelectronics Conference (NEC)

المؤلفون: Haatainen, T., Majander, P., Makela, T., Ahopelto, J.

المصدر: 2007 Digest of papers Microprocesses and Nanotechnology Microprocesses and Nanotechnology, 2007 Digest of papers. :280-281 Nov, 2007

Relation: 2007 Digest of Papers Microprocesses and Nanotechnology