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المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023

Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Umunnakwe, C. B., Zawra, I., Rudnyi, E. B., Niessner, M., Bechtold, T.

المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023

Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Umunnakwe, C. B., Zawra, I., Yuan, C., Rudnyi, E. B., Hohlfeld, D., Niessner, M., Bechtold, T.

المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-5 Apr, 2022

Relation: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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المؤلفون: Umunnakwe, C. N., Makatini, Z. N., Mdunyelwa, A., Maphanga, M., Nijhuis, M., Wensing, A., Tempelman, H. A.

المصدر: SAMJ: South African Medical Journal; Feb2022, Vol. 112 Issue 2, p81-85, 5p

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المؤلفون: Buchholtz, N., Hermans, L., Umunnakwe, C., De Jong, T., Osman, A., Symons, J., Tempelman, H., Wensing, A., Nijhuis, M.

المصدر: Journal of Virus Eradication; December 2022, Vol. 8 Issue: 1, Number 1 Supplement 1