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1مؤتمر
المؤلفون: Stencel, Lisa Christin, Strogies, Jorg, Muller, Bernd, Knofe, Rudiger, Borwieck, Carsten, Heimann, Matthias
المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :175-183 Sep, 2022
Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
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2مؤتمر
المؤلفون: Luo, Wan, Liang, Jun-Jie, Zhang, Yun, Zhou, Hua-Min
المصدر: 2016 17th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2016 17th International Conference on. :1387-1390 Aug, 2016
Relation: 2016 17th International Conference on Electronic Packaging Technology (ICEPT)
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3مؤتمر
المؤلفون: Luo, Wan, Liang, Jun-Jie, Zhang, Yun, Zhou, Hua-Min
المصدر: 2016 17th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2016 17th International Conference on. :1381-1386 Aug, 2016
Relation: 2016 17th International Conference on Electronic Packaging Technology (ICEPT)
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4دورية أكاديمية
المؤلفون: Rizwan Ul Hassan, Shaheer Mohiuddin Khalil, Saeed Ahmed Khan, Joonkyeong Moon, Dae-Hyun Cho, Doyoung Byun
المصدر: Heliyon, Vol 9, Iss 6, Pp e16395- (2023)
مصطلحات موضوعية: Viscous fluids, Electric potential, Underfill flow, Science (General), Q1-390, Social sciences (General), H1-99
وصف الملف: electronic resource
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5دورية أكاديمية
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 2(6):893-902 Jun, 2012
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6دورية أكاديمية
المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 33(1):196-205 Mar, 2010
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7دورية أكاديمية
المؤلفون: Wan, J. W., Zhang, W. J., Bergstrom, D. J.
المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 32(2):227-234 Jun, 2009
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8دورية أكاديمية
المؤلفون: Wen-Bin Young, Wen-Lin Yang
المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 29(3):647-653 Aug, 2006
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9دورية أكاديمية
المؤلفون: Wan, J.W., Zhang, W.J., Bergstrom, D.J.
المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 28(3):481-487 Aug, 2005
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10دورية أكاديمية
المؤلفون: Jinlin Wang
المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 28(2):366-370 Jun, 2005