يعرض 1 - 10 نتائج من 54 نتيجة بحث عن '"Underfill flow"', وقت الاستعلام: 1.16s تنقيح النتائج
  1. 1
    مؤتمر

    المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :175-183 Sep, 2022

    Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)

  2. 2
    مؤتمر

    المصدر: 2016 17th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2016 17th International Conference on. :1387-1390 Aug, 2016

    Relation: 2016 17th International Conference on Electronic Packaging Technology (ICEPT)

  3. 3
    مؤتمر

    المصدر: 2016 17th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2016 17th International Conference on. :1381-1386 Aug, 2016

    Relation: 2016 17th International Conference on Electronic Packaging Technology (ICEPT)

  4. 4
  5. 5
    دورية أكاديمية

    المؤلفون: Zhou, S., Sun, Y.

    المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 2(6):893-902 Jun, 2012

  6. 6
    دورية أكاديمية

    المؤلفون: Zheng, L., Sun, Y.

    المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 33(1):196-205 Mar, 2010

  7. 7
    دورية أكاديمية

    المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 32(2):227-234 Jun, 2009

  8. 8
    دورية أكاديمية

    المؤلفون: Wen-Bin Young, Wen-Lin Yang

    المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 29(3):647-653 Aug, 2006

  9. 9
    دورية أكاديمية

    المؤلفون: Wan, J.W., Zhang, W.J., Bergstrom, D.J.

    المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 28(3):481-487 Aug, 2005

  10. 10
    دورية أكاديمية

    المؤلفون: Jinlin Wang

    المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 28(2):366-370 Jun, 2005