المؤلفون: Cai, Yuanhao, Takeuchi, Kai, Uomoto, Miyuki, Shimatsu, Takehito, Higurashi, Eiji

المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :117-118 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

المؤلفون: Kamba, Yasuhiro, Qu, Chen, Miura, Taisuke, Uomoto, Miyuki, Shimatsu, Takehito

المصدر: 2022 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR) Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2022 Conference on. :1-2 Jul, 2022

Relation: 2022 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR)

المؤلفون: Mu, Fengwen, Suga, Tadatomo, Uomoto, Miyuki, Shimatsu, Takehito

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :989-994 May, 2019

Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

المؤلفون: Ebizuka, Noboru, Okamoto, Takayuki, Sasaki, Minoru, Tanaka, Ichi, Uomoto, Miyuki, Shimatsu, Takehito

المصدر: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2019 6th International Workshop on. :77-77 May, 2019

Relation: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

المؤلفون: Mu, Fengwen, Suga, Tadatomo, Uomoto, Miyuki, Shimatsu, Takehito, Iguchi, Kenichi, Nakazawa, Haruo

المصدر: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2019 6th International Workshop on. :4-4 May, 2019

Relation: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

المؤلفون: Higashiguchi, Takeshi, Yamauchi, Syun, Fujii, Yusuke, Shinozaki, Natsumi, Ogura, Takuto, Uomoto, Miyuki, Shimatsu, Takehito, Miura, Taisuke, Mocek, Tomas

المصدر: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2017 5th International Workshop on. :49-49 May, 2017

Relation: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

المؤلفون: Mu, Fengwen, Uomoto, Miyuki, Shimatsu, Takehito, Wang, Yinghui, Iguchi, Kenichi, Nakazawa, Haruo, Takahashi, Yoshikazu, Higurashi, Eiji, Suga, Tadatomo

المصدر: In Applied Surface Science 28 January 2019 465:591-595

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