المؤلفون: Sloyan, K., Ravaux, F., Zhao, Z., Kleimaier, D., Utess, D., Lehmann, S., Andee, Y., Hoentschel, J., Ghaferi, A.A., Saadat, I.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 68(7):3230-3237 Jul, 2021

المؤلفون: Sessi, V., Simon, M., Slesazeck, S., Drescher, M., Mulaosmanovic, H., Li, K., Binder, R., Waidmann, S., Zeun, A., Pawlik, A.-S., Utess, D., Gottleuber, V., Muller, S., Feldner, K., Heinzig, A., Dunkel, S., Kolodinski, S., Mikolajick, T., Trommer, J., Wiatr, M.

المصدر: 2021 Silicon Nanoelectronics Workshop (SNW) Silicon Nanoelectronics Workshop (SNW), 2021. :1-2 Jun, 2021

Relation: 2021 Silicon Nanoelectronics Workshop (SNW)

المؤلفون: Schippel, C., Lehmann, S., Ong, S.N., Muehlhoff, A., Cortes, I., Chow, W.H., Utess, D., Zaka, A., Divay, A., Pakfar, A., Faul, J., Mazurier, J., Chew, K.W., Chan, L.H.K., Taylor, R., Rice, B., Harame, D.

المصدر: 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2018 IEEE. :1-3 Oct, 2018

Relation: 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

المؤلفون: Triyoso, D. H., Weinreich, W., Seidell, K., Nolan, M. G., Polakowski, P., Utess, D., Ohsiek, S., Dittmar, K., Weisheit, M., Licbau, M., Fox, R.

المصدر: 2014 IEEE International Conference on IC Design & Technology IC Design & Technology (ICICDT), 2014 IEEE International Conference on. :1-4 May, 2014

Relation: 2014 IEEE International Conference on IC Design & Technology (ICICDT)

المؤلفون: Utess, D., Wuerfel, A., Langer, E., Engelmann, H.J., Lehmann, R.

المصدر: 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the. :1-4 Jul, 2011

Relation: 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2011)

المؤلفون: Trentzsch, M., Flachowsky, S., Richter, R., Paul, J., Reimer, B., Utess, D., Jansen, S., Mulaosmanovic, H., Muller, S., Slesazeck, S., Ocker, J., Noack, M., Muller, J., Polakowski, P., Schreiter, J., Beyer, S., Mikolajick, T., Rice, B.

المصدر: 2016 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2016 IEEE International. :11.5.1-11.5.4 Dec, 2016

Relation: 2016 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Engelmann, H. J.^Aff2, Geisler, H.^Aff2, Huebner, R.^Aff2, Potapov, P.^Aff2, Utess, D.^Aff2, Zschech, E.^Aff2

المساهمون: Richter, Silvia, editor^Aff1, Schwedt, Alexander, editor^Aff1

المصدر: EMC 2008 14th European Microscopy Congress 1–5 September 2008, Aachen, Germany : Volume 2: Materials Science. :13-14

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