المؤلفون: Vermeulen, A., Lopes, P., Devlieghere, F., Ragaert, P., Vanfleteren, J., Khashayar, P.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(8):13122-13128 Apr, 2024

المؤلفون: Yang, Y., Plovie, B., Chiesura, G., Vervust, T., Daelemans, L., Mogosanu, D., Wuytens, P., De Clerck, K., Vanfleteren, J.

المصدر: IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 70:1-9 2021

المؤلفون: Plovie, B., Vanfleteren, J., Vervust, T., Vasquez Quintero, A., Bossuyt, F.

المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 38(9):1648-1660 Sep, 2019

المؤلفون: Plovie, B., Yang, Y., Dunphy, S., Dhaenens, K., Van Put, S., Bossuyt, F., Vanfleteren, J.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 9(5):955-962 May, 2019

المؤلفون: Vanfleteren, J., Bossuyt, F., Plovie, B.

المصدر: 2016 12th International Congress Molded Interconnect Devices (MID) Molded Interconnect Devices (MID), 2016 12th International Congress. :1-4 Sep, 2016

Relation: 2016 12th International Congress Molded Interconnect Devices (MID)

المؤلفون: Lemey, S., Agneessens, S., Van Torre, P., Baes, K., Vanfleteren, J., Rogier, H.

المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 64(7):2304-2314 Jul, 2016

المؤلفون: Chtioui, I., Bossuyt, F., de Kok, M., Vanfleteren, J., Bedoui, M.H.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 6(4):533-544 Apr, 2016

المؤلفون: Van Keymeulen, B., Gonzalez, M., Bossuyt, F., De Baets, J., Vanfleteren, J.

المصدر: 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on. :1-8 Apr, 2014

Relation: 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Verplancke, R., Sterken, T., Cuypers, D., Vanfleteren, J.

المصدر: 2012 4th Electronic System-Integration Technology Conference Electronic System-Integration Technology Conference (ESTC), 2012 4th. :1-5 Sep, 2012

Relation: 2012 4th Electronic System-Integration Technology Conference (ESTC)

المؤلفون: Priyabadini, S., Sterken, T., Wang, L., Dhaenens, K., Vandecasteele, B., Van Put, S., Petersen, A.E., Vanfleteren, J.

المصدر: 2012 4th Electronic System-Integration Technology Conference Electronic System-Integration Technology Conference (ESTC), 2012 4th. :1-4 Sep, 2012

Relation: 2012 4th Electronic System-Integration Technology Conference (ESTC)