المؤلفون: Vandooren, A., Franco, J., Parvais, B., Wu, Z., Witters, L., Walke, A., Li, W., Peng, L., Deshpande, V., Bufler, F.M., Rassoul, N., Hellings, G., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Rosseel, E., Vanherle, W., Hikavyy, A., Chan, B.T., Ritzenthaler, R., Besnard, G., Schwarzenbach, W., Gaudin, G., Radu, I., Nguyen, B., Waldron, N., De Heyn, V., Mocuta, D., Collaert, N.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 65(11):5165-5171 Nov, 2018

المؤلفون: Vandooren, A., Wu, Z., Khaled, A., Franco, J., Parvais, B., Li, W., Witters, L., Walke, A., Peng, L., Rassoul, N., Matagne, P., Debruyn, H., Jamieson, G., Inoue, F., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Radisic, D., Rosseel, E., Vanherle, W., Hikavyy, A., Chan, B. T., Besnard, G., Schwarzenbach, W., Gaudin, G., Radu, I., Nguyen, B.-Y., Waldron, N., De Heyn, V., Demuynck, S., Boemmels, J., Ryckaert, J., Collaert, N., Mocuta, D.

المصدر: 2019 Symposium on VLSI Technology VLSI Technology, 2019 Symposium on. :T56-T57 Jun, 2019

Relation: 2019 Symposium on VLSI Technology

المؤلفون: Srinivasan, S. A., Verheyen, P., Loo, R., De Wolf, I., Pantouvaki, M., Lepage, G., Balakrishnan, S., Vanherle, W., Absil, P., Van Campenhout, J.

المصدر: 2016 Optical Fiber Communications Conference and Exhibition (OFC) Optical Fiber Communications Conference and Exhibition (OFC), 2016. :1-3 Mar, 2016

Relation: 2016 Optical Fiber Communications Conference and Exhibition (OFC)

المؤلفون: Vandooren, A., Franco, J., Parvais, B., Wu, Z., Witters, L., Walke, A., Li, W., Peng, L., Desphande, V., Bufler, F.M., Rassoul, N., Hellings, G., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Rosseel, E., Vanherle, W., Hikavyy, A., Chan, B. T., Ritzenthaler, R., Besnard, G., Schwarzenbach, W., Gaudin, G., Radu, I., Nguyen, B.-Y., Waldron, N., Heyn, V. De, Mocuta, D., Collaert, N.

المصدر: 2018 IEEE Symposium on VLSI Technology VLSI Technology, 2018 IEEE Symposium on. :69-70 Jun, 2018

Relation: 2018 IEEE Symposium on VLSI Technology

المؤلفون: Vandooren, A., Franco, J., Wu, Z., Parvais, B., Li, W., Witters, L., Walke, A., Peng, L., Deshpande, V., Rassoul, N., Hellings, G., Jamieson, G., Inoue, F., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Rosseel, E., Vanherle, W., Hikavyy, A., Mannaert, G., Chan, B. T., Ritzenthaler, R., Mitard, J., Ragnarsson, L., Waldron, N., De Heyn, V., Demuynck, S., Boemmels, J., Mocuta, D., Ryckaert, J., Collaert, N.

المصدر: 2018 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2018 IEEE International. :7.1.1-7.1.4 Dec, 2018

Relation: 2018 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Van Huylenbroeck, S., Sibaja-Hernandez, A., Venegas, R., You, S., Vleugels, F., Radisic, D., Lee, W., Vanherle, W., De Meyer, K., Decoutere, S.

المصدر: 2011 IEEE Bipolar/BiCMOS Circuits and Technology Meeting Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2011 IEEE. :66-69 Oct, 2011

Relation: 2011 IEEE Bipolar/BiCMOS Circuits and Technology Meeting - BCTM

المؤلفون: Absil, P., Croes, K., Lesniewska, A., De Heyn, P., Ban, Y., Snyder, B., De Coster, J., Fodor, F., Simons, V., Balakrishnan, S., Lepage, G., Golshani, N., Lardenois, S., Srinivasan, S. A., Chen, H., Vanherle, W., Loo, R., Boufadil, R., Detalle, M., Miller, A., Verheyen, P., Pantouvaki, M., Van Campenhout, J.

المصدر: 2017 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2017 IEEE International. :34.2.1-34.2.4 Dec, 2017

Relation: 2017 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Arimura, H., Cott, D., Loo, R., Vanherle, W., Xie, Q., Tang, F., Jiang, X., Franco, J., Sioncke, S., Ragnarsson, L.-A., Chiu, E., Lu, X., Geypen, J., Bender, H., Maes, J. W., Givens, M., Sibaja-Hernandez, A., Wostyn, K., Boccardi, G., Mitard, J., Collaert, N., Mocuta, D.

المصدر: 2016 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2016 IEEE International. :33.4.1-33.4.4 Dec, 2016

Relation: 2016 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Arimura, H., Sioncke, S., Cott, D., Mitard, J., Conard, T., Vanherle, W., Loo, R., Favia, P., Bender, H., Meersschaut, J., Witters, L., Mertens, H., Franco, J., Ragnarsson, L.-A., Pourtois, G., Heyns, M., Mocuta, A., Collaert, N., Thean, A.V.-Y.

المصدر: 2015 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2015 IEEE International. :21.6.1-21.6.4 Dec, 2015

Relation: 2015 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Sioncke, S., Vanherle, W., Art, W., Ceuppens, J., Ivanov, Ts., Lin, D., Nyns, L., Delabie, A., Conard, T., Struyf, H., De Gendt, S., Caymax, M., Collaert, N., Thean, A.

المصدر: In Microelectronic Engineering September 2013 109:46-49