المؤلفون: Furuhashi, T., Haneda, M., Sasaki, T., Kagawa, Y., Ooka, Y., Hirano, T., Saito, M., Ohno, K., Iwamoto, H., Liu, Y., Hiblot, G., Vanstreels, K., Gonzalez, M., Velenis, D., Beyer, G., Plas, G. Van der, Wolf, I. De, Beyne, E.

المصدر: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-4 Sep, 2019

Relation: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Salahouelhadj, A., Gonzalez, M., Vanstreels, K., Podpod, A., Phommahaxay, A., Rebibis, K., Beyne, E.

المصدر: 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2019 20th International Conference on. :1-7 Mar, 2019

Relation: 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Okudur, O. O., Rcdzheb, M., Vanstreels, K., Zahcdnamesh, H., Gonzalez, M., De Wolf, I.

المصدر: 2018 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2018 IEEE International. :118-120 Jun, 2018

Relation: 2018 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: Tokei, Zs., Vega, V., Murdoch, G., O'Toole, M., Croes, K., Baert, R., Veen, M. Van der, Adelmann, C., Soulie, J. P., Boemmels, J., Wilson, C., Park, S. H., Sankaran, K., Pourtois, G., Sweerts, J., Paolillo, S., Decoster, S., Mao, M., Lazzarino, F., Versluijs, J., Blanco, V., Ercken, M., Kesters, E., Le, Q-T., Holsteyns, F., Heylen, N., Teugels, L., Devriendt, K., Struyf, H., Morin, P., Jourdan, N., Elshocht, S. Van, Ciofi, I., Gupta, A., Zahedmanesh, H., Vanstreels, K., Na, M. H.

المصدر: 2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :32.2.1-32.2.4 Dec, 2020

Relation: 2020 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Tang, Y., Derakhshandeh, J., Kho, Y., Chang, Y., Slabbekoorn, J., De Preter, I., Vanstreels, K., Rebibis, K.J., Beyne, E., Chen, K.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 7(11):1899-1905 Nov, 2017

المؤلفون: Krishtab, M., Vanstreels, K., De Gendt, S., Baklanov, M.

المصدر: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International. :103-106 May, 2015

Relation: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

المؤلفون: Redzheb, M., Prager, L., Krishtab, M., Armini, S., Vanstreels, K., Franquet, Alexis, Van Der Voort, P., Baklanov, M.R.

المصدر: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International. :99-102 May, 2015

Relation: 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

المؤلفون: Redzheb, M., Armini, S., Vanstreels, K., Meersschaut, J., Baklanov, M.R., Wang, Y., Chen, S., Le, V., Awdshiew, M., Van Der Voort, P.

المصدر: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016 IEEE International. :156-158 May, 2016

Relation: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)

المؤلفون: Cherman, V., Van der Plas, G., De Vos, J., Ivankovic, A., Lofrano, M., Simons, V., Gonzalez, M., Vanstreels, K., Wang, T., Daily, R., Guo, W., Beyer, G., Manna, A. La, De Wolf, I., Beyne, E.

المصدر: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :309-315 May, 2014

Relation: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

المؤلفون: Verdonck, P., Le, Quoc Toan, Krishtab, M., Vanstreels, K., Armini, S., Simone, A., Nguyen, Mai Phuong, Baklanov, M.R., Van Elshocht, S.

المصدر: IEEE International Interconnect Technology Conference Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International. :155-158 May, 2014

Relation: 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)