يعرض 1 - 10 نتائج من 45 نتيجة بحث عن '"Varaprasad, B.K.S.V.L."', وقت الاستعلام: 1.15s تنقيح النتائج
  1. 1
    مؤتمر
    On Board Computation of Base Products for Rain Characteristics with Pulse Pair Algorithm

    المؤلفون: Murthy, D.V.N.S.N., Kishore, J. Krishna, Varaprasad, B.K.S.V.L.

    المصدر: 2022 First International Conference on Electrical, Electronics, Information and Communication Technologies (ICEEICT) Electrical, Electronics, Information and Communication Technologies (ICEEICT), 2022 First International Conference on. :1-6 Feb, 2022

    Relation: 2022 First International Conference on Electrical, Electronics, Information and Communication Technologies (ICEEICT)

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  2. 2
    مؤتمر
    Configurable Drive Scheme for Stepper Motors in Space Application

    المؤلفون: Lekshmi, V, Varaprasad, B.K.S.V.L., Navle Sonal, G., Vishnu, T.S.

    المصدر: 2022 First International Conference on Electrical, Electronics, Information and Communication Technologies (ICEEICT) Electrical, Electronics, Information and Communication Technologies (ICEEICT), 2022 First International Conference on. :1-8 Feb, 2022

    Relation: 2022 First International Conference on Electrical, Electronics, Information and Communication Technologies (ICEEICT)

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  3. 3
    مؤتمر
    Design of a Novel Discrete Command Generation and Distribution Scheme for Spacecrafts

    المؤلفون: Kumar, A. Rajendra, Varaprasad, B.K.S.V.L., Kishore, J. Krishna

    المصدر: 2022 First International Conference on Electrical, Electronics, Information and Communication Technologies (ICEEICT) Electrical, Electronics, Information and Communication Technologies (ICEEICT), 2022 First International Conference on. :1-7 Feb, 2022

    Relation: 2022 First International Conference on Electrical, Electronics, Information and Communication Technologies (ICEEICT)

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  4. 4
    مؤتمر
    Design of Watchdog Circuit using Decision Trees for Detection of Single Event Upsets in Processor

    المؤلفون: Varaprasad, B.K.S.V.L., Anilkumar, Rahul, Prasad, Bondapalli Akhilesh, Bondapalli, Shivani Prasad, Padmapriya, K.

    المصدر: 2021 Third International Conference on Inventive Research in Computing Applications (ICIRCA) Inventive Research in Computing Applications (ICIRCA), 2021 Third International Conference on. :1306-1311 Sep, 2021

    Relation: 2021 Third International Conference on Inventive Research in Computing Applications (ICIRCA)

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  5. 5
    مؤتمر
    Improving Test Coverage of Hi-Reliability ASIC Designs with Test Point Insertion for Space Applications

    المؤلفون: Padmapriya, K, Varaprasad, B.K.S.V.L.

    المصدر: 2020 International Conference on Smart Electronics and Communication (ICOSEC) Smart Electronics and Communication (ICOSEC), 2020 International Conference on. :1099-1103 Sep, 2020

    Relation: 2020 International Conference on Smart Electronics and Communication (ICOSEC)

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  6. 6
    مؤتمر
    A Survey on Test Point Insertion (TPI) Schemes

    المؤلفون: Padmapriya, K., Varaprasad, B.K.S.V.L., Varalakshmi, N.

    المصدر: 2020 International Conference on Inventive Computation Technologies (ICICT) Inventive Computation Technologies (ICICT), 2020 International Conference on. :107-112 Feb, 2020

    Relation: 2020 International Conference on Inventive Computation Technologies (ICICT)

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  7. 7
    مؤتمر
    Goal-Based Approach for Selection or Design of An RHBD Latch Circuit – A Tutorial

    المؤلفون: Sajjade, Faisal Mustafa, Kumar Goyal, Neeraj, Varaprasad, B.K.S.V.L.

    المصدر: 2020 International Conference on Inventive Computation Technologies (ICICT) Inventive Computation Technologies (ICICT), 2020 International Conference on. :1007-1013 Feb, 2020

    Relation: 2020 International Conference on Inventive Computation Technologies (ICICT)

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  8. 8
    دورية أكاديمية
    Single Event Transient (SET) Mitigation Circuits With Immune Leaf Nodes

    المؤلفون: Sajjade, F.M., Goyal, N.K., Varaprasad, B.K.S.V.L.

    المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 21(1):70-78 Mar, 2021

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  9. 9
    دورية أكاديمية
    Plasma Treatment and Copper Metallization for Reliable Plated-Through-Holes in Microwave PCBs for Space Electronic Packaging

    المؤلفون: Rao C., H., Kothuru, A., Singh, A.P., Varaprasad, B.K.S.V.L., Goel, S.

    المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(11):1921-1928 Nov, 2020

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  10. 10
    دورية أكاديمية
    Rule-Based Design for Multiple Nodes Upset Tolerant Latch Architecture

    المؤلفون: Sajjade, F.M., Goyal, N.K., Varaprasad, B.K.S.V.L.

    المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 19(4):680-687 Dec, 2019

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