يعرض 1 - 10 نتائج من 439 نتيجة بحث عن '"Vasan R"', وقت الاستعلام: 1.76s تنقيح النتائج
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    كتاب إلكتروني

    المؤلفون: Vasan, R. S.Aff3

    المساهمون: Mishra, Swati, editorAff1, Sheel, Ranjana, editorAff2

    المصدر: India-China Dialogues Beyond Borders : Cultural, Social Economic and Political Perspectives. :123-132

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    كتاب إلكتروني

    المؤلفون: Vasan, R. VishnuAff8, Vijayalakshmi, MuthuswamyAff8

    المساهمون: Bansal, Jagdish Chand, Series EditorAff1, Deep, Kusum, Series EditorAff2, Nagar, Atulya K., Series EditorAff3, Shukla, Praveen Kumar, editorAff4, Singh, Krishna Pratap, editorAff5, Tripathi, Ashish Kumar, editorAff6, Engelbrecht, Andries, editorAff7

    المصدر: Computer Vision and Robotics : Proceedings of CVR 2022. :401-410

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    كتاب إلكتروني

    المؤلفون: Krishnan, S.Aff10, Vasan, R. VishnuAff10, Varma, PranayAff10, Mala, T.Aff10

    المساهمون: Filipe, Joaquim, Editorial Board MemberAff1, Ghosh, Ashish, Editorial Board MemberAff2, Prates, Raquel Oliveira, Editorial Board MemberAff3, Zhou, Lizhu, Editorial Board MemberAff4, Woungang, Isaac, editorAff5, Dhurandher, Sanjay Kumar, editorAff6, Pattanaik, Kiran Kumar, editorAff7, Verma, Anshul, editorAff8, Verma, Pradeepika, editorAff9

    المصدر: Advanced Network Technologies and Intelligent Computing : Second International Conference, ANTIC 2022, Varanasi, India, December 22–24, 2022, Proceedings, Part II. 1798:138-152

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    دورية أكاديمية

    المصدر: Wei, G. S. and Coady, S. A. and Goff, D. C. and Brancati, F. L. and Levy, D. and Selvin, E. and Vasan, R. S. and Fox, C. S. (2011) Blood Pressure and the Risk of Developing Diabetes in African Americans and Whites: ARIC, CARDIA, and the Framingham Heart Study. Diabetes Care, 34 (4). pp. 873-879. ISSN 0149-5992

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    دورية أكاديمية

    المصدر: IEEE Journal of Photovoltaics IEEE J. Photovoltaics Photovoltaics, IEEE Journal of. 6(6):1509-1514 Nov, 2016

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    دورية أكاديمية

    المؤلفون: Vasan, R., Salman, H., Manasreh, M.O.

    المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 39(4):536-539 Apr, 2018

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