المؤلفون: Vasudevan Ayyappan, Venkateswara R. Sripathi, Shaojun Xie, Malay C. Saha, Rita Hayford, Desalegn D. Serba, Mayavan Subramani, Jyothi Thimmapuram, Antonette Todd, Venu Kal Kalavacharla

المصدر: BMC Genomics, Vol 25, Iss 1, Pp 1-19 (2024)

مصطلحات موضوعية: Switchgrass, Drought, Heat, Stress, Chromatin, ChIP-Seq, Biotechnology, TP248.13-248.65, Genetics, QH426-470

وصف الملف: electronic resource

Relation: https://doaj.org/toc/1471-2164

URL الوصول: https://doaj.org/article/efaed5db28a3437e93d056b85a3e2e47

المؤلفون: Velmurugan Ganesan, Vigneshwaran Shanmugam, Vasudevan Alagumalai, Babu Kaliyamoorthy, Oisik Das, Manjusri Misra

المصدر: Composites Part C: Open Access, Vol 13, Iss , Pp 100433- (2024)

مصطلحات موضوعية: Taguchi-Grey relational analysis, Natural fibre, Chemical treatment, Compression moulding, Composites, Mechanical properties, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2666682024000045; https://doaj.org/toc/2666-6820

URL الوصول: https://doaj.org/article/00e63518560f49e6bbd7c524935cd5b9

المؤلفون: K. Yoganandam, K. Premkumar, Vasudevan Alagumalai, Jiang Lin, Vigneshwaran Shanmugam, Oisik Das

المصدر: Polymer Testing, Vol 127, Iss , Pp 108191- (2023)

مصطلحات موضوعية: Flexural strength, Interlaminar shear strength, Puncture resistance, Multi-walled carbon nanotubes, Glass/epoxy composites, Polymers and polymer manufacture, TP1080-1185

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S0142941823002714; https://doaj.org/toc/0142-9418

URL الوصول: https://doaj.org/article/4b992b2705844696b4628aca81e7118b

المؤلفون: Singh, P., Palmer, L., Wassick, T., Aspandiar, R. F., Franco, B., Fu, H., Vasudevan, V., Allen, A., Howell, K., Murayama, K., Zhang, H., Lifton, A., Munson, T., Middleton, S., Coyle, R., Murali, S.

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1433-1438 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Nair, Vineeta Vasudevan, P, Anilkumar, James, Alex

المصدر: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-5 May, 2024

Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)

المؤلفون: Irine Rose Antony, Aathira Pradeep, Anoop Vasudevan Pillai, Riju Ramachandran Menon, Vasudevan Anil Kumar, Rangasamy Jayakumar

المصدر: Journal of Functional Biomaterials, Vol 14, Iss 10, p 528 (2023)

مصطلحات موضوعية: chitosan hydrogel, poly(hexamethylene) biguanide, antibacterial activity, antiseptic, antibiofilm, infectious wounds, Biotechnology, TP248.13-248.65, Medicine (General), R5-920

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2079-4983/14/10/528; https://doaj.org/toc/2079-4983

URL الوصول: https://doaj.org/article/de192f2576cf4533a75896ba0d0a1a5b

المؤلفون: Rita K. Hayford, Desalegn D. Serba, Shaojun Xie, Vasudevan Ayyappan, Jyothi Thimmapuram, Malay C. Saha, Cathy H. Wu, Venu Kal Kalavacharla

المصدر: BMC Plant Biology, Vol 22, Iss 1, Pp 1-23 (2022)

مصطلحات موضوعية: Panicum virgatum, Transcriptome, Drought stress, Heat stress, Transcription factors, Gene ontology, Botany, QK1-989

وصف الملف: electronic resource

Relation: https://doaj.org/toc/1471-2229

URL الوصول: https://doaj.org/article/2ad118256a3e4b0bacc22be3b65e4b37

المؤلفون: Sender, T., Brudnak, M., Steiger, R., Vasudevan, R., Epureanu, B.

المصدر: IEEE Robotics and Automation Letters IEEE Robot. Autom. Lett. Robotics and Automation Letters, IEEE. 9(6):5354-5361 Jun, 2024

المؤلفون: Cheng, R., Vasudevan, D., Kirst, C.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 34(3):1-12 May, 2024

المؤلفون: Sharma, Ruchita, Kharade, Mayur Annasaheb, Kamthe, Samrat Suresh, Vasudevan, Abin Raju, Dalvi, Sarthak

المصدر: 2024 MIT Art, Design and Technology School of Computing International Conference (MITADTSoCiCon) MIT Art, Design and Technology School of Computing International Conference (MITADTSoCiCon), 2024. :1-4 Apr, 2024

Relation: 2024 MIT Art, Design and Technology School of Computing International Conference (MITADTSoCiCon)