المؤلفون: Vandooren, A., Witters, L., Franco, J., Mallik, A., Parvais, B., Wu, Z., Li, W., Rosseel, E., Hikkavyy, A., Peng, L., Rassoul, N., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Waldron, N., Boemmels, J., De Heyn, V., Mocuta, D., Ryckaert, J., Collaert, N.

المصدر: 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2018 IEEE. :1-4 Oct, 2018

Relation: 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

المؤلفون: Vandooren, A., Witters, L., Franco, J., Mallik, A., Parvais, B., Wu, Z., Walke, A., Deshpande, V., Rosseel, E., Hikavyy, A., Li, W., Peng, L., Rassoul, N., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Waldron, N., De Heyn, V., Mocuta, D., Collaert, N.

المصدر: 2018 International Conference on IC Design & Technology (ICICDT) IC Design & Technology (ICICDT), 2018 International Conference on. :145-148 Jun, 2018

Relation: 2018 International Conference on IC Design & Technology (ICICDT)

المؤلفون: Vandooren, A., Franco, J., Parvais, B., Wu, Z., Witters, L., Walke, A., Li, W., Peng, L., Deshpande, V., Bufler, F.M., Rassoul, N., Hellings, G., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Rosseel, E., Vanherle, W., Hikavyy, A., Chan, B.T., Ritzenthaler, R., Besnard, G., Schwarzenbach, W., Gaudin, G., Radu, I., Nguyen, B., Waldron, N., De Heyn, V., Mocuta, D., Collaert, N.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 65(11):5165-5171 Nov, 2018

المؤلفون: Vandooren, A., Wu, Z., Parihar, N., Franco, J., Parvais, B., Matagne, P., Debruyn, H., Mannaert, G., Devriendt, K., Teugels, L., Vecchio, E., Radisic, D., Rosseel, E., Hikavyy, A., Chan, B. T., Waldron, N., Mitard, J., Besnard, G., Alvarez, A., Gaudin, G., Schwarzenbach, W., Radu, I., Nguyen, B. Y., Huet, K., Tabata, T., Mazzamuto, F., Demuynck, S., Boemmels, J., Collaert, N., Horiguchi, N.

المصدر: 2020 IEEE Symposium on VLSI Technology VLSI Technology, 2020 IEEE Symposium on. :1-2 Jun, 2020

Relation: 2020 IEEE Symposium on VLSI Technology

المؤلفون: Veloso, A., Huynh-Bao, T., Rosseel, E., Paraschiv, V., Devriendt, K., Vecchio, E., Delvaux, C., Chan, B. T., Ercken, M., Tao, Z., Li, W., Altamirano-Sanchez, E., Versluijs, J. J., Brus, S., Matagne, P., Waldron, N., Ryckaert, J., Mocuta, D., Collaert, N.

المصدر: 2016 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2016 IEEE. :1-3 Oct, 2016

Relation: 2016 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

المؤلفون: Veloso, A., Eneman, G., Huynh-Bao, T., Chasin, A., Simoen, E., Vecchio, E., Devriendt, K., Brus, S., Rosseel, E., Hikavyy, A., Loo, R., Paraschiv, V., Chan, B. T., Radisic, D., Li, W., Versluijs, J. J., Teugels, L., Sebaai, F., Favia, P., Bender, H., Vancoille, E., Scheerder, J. E., Fleischmann, C., Horiguchi, N., Matagne, P.

المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :11.1.1-11.1.4 Dec, 2019

Relation: 2019 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Vandooren, A., Wu, Z., Khaled, A., Franco, J., Parvais, B., Li, W., Witters, L., Walke, A., Peng, L., Rassoul, N., Matagne, P., Debruyn, H., Jamieson, G., Inoue, F., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Radisic, D., Rosseel, E., Vanherle, W., Hikavyy, A., Chan, B. T., Besnard, G., Schwarzenbach, W., Gaudin, G., Radu, I., Nguyen, B.-Y., Waldron, N., De Heyn, V., Demuynck, S., Boemmels, J., Ryckaert, J., Collaert, N., Mocuta, D.

المصدر: 2019 Symposium on VLSI Technology VLSI Technology, 2019 Symposium on. :T56-T57 Jun, 2019

Relation: 2019 Symposium on VLSI Technology

المؤلفون: de Tommaso, M., Vecchio, E., Ricci, K., Montemurno, A., De Venuto, D., Annese, V.F.

المصدر: 2015 6th International Workshop on Advances in Sensors and Interfaces (IWASI) Advances in Sensors and Interfaces (IWASI), 2015 6th IEEE International Workshop on. :181-186 Jun, 2015

Relation: 2015 6th IEEE International Workshop on Advances in Sensors and Interfaces (IWASI)

المؤلفون: Delhougne, R., Arreghini, A., Rosseel, E., Hikavyy, A., Vecchio, E., Zhang, L., Pak, M., Nyns, L., Raymaekers, T., Jossart, N., Breuil, L., V-Palayam, S. S., Tan, C.-L., Van den bosch, G., Furnemont, A.

المصدر: 2018 IEEE Symposium on VLSI Technology VLSI Technology, 2018 IEEE Symposium on. :203-204 Jun, 2018

Relation: 2018 IEEE Symposium on VLSI Technology

المؤلفون: Vandooren, A., Franco, J., Parvais, B., Wu, Z., Witters, L., Walke, A., Li, W., Peng, L., Desphande, V., Bufler, F.M., Rassoul, N., Hellings, G., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Rosseel, E., Vanherle, W., Hikavyy, A., Chan, B. T., Ritzenthaler, R., Besnard, G., Schwarzenbach, W., Gaudin, G., Radu, I., Nguyen, B.-Y., Waldron, N., Heyn, V. De, Mocuta, D., Collaert, N.

المصدر: 2018 IEEE Symposium on VLSI Technology VLSI Technology, 2018 IEEE Symposium on. :69-70 Jun, 2018

Relation: 2018 IEEE Symposium on VLSI Technology