المؤلفون: Bhagavatula, Venkata Vaibhav, Pandhare, Rashmi, Rathi, Aparna, Veeraraghavan, S.

المصدر: 2021 IEEE International Conference on Electronics, Computing and Communication Technologies (CONECCT) Electronics, Computing and Communication Technologies (CONECCT), 2021 IEEE International Conference on. :01-06 Jul, 2021

Relation: 2021 IEEE International Conference on Electronics, Computing and Communication Technologies (CONECCT)

المؤلفون: O, Gayathri K, Rathi, Aparna, Veeraraghavan, S, Seshagiri, D

المصدر: 2021 IEEE International Conference on Electronics, Computing and Communication Technologies (CONECCT) Electronics, Computing and Communication Technologies (CONECCT), 2021 IEEE International Conference on. :1-6 Jul, 2021

Relation: 2021 IEEE International Conference on Electronics, Computing and Communication Technologies (CONECCT)

المؤلفون: Fan, Su-Chen, Xie, Ruilong, Wu, Heng, Liu, Zuoguang, Frougier, Julien, Greene, Andrew, Pancharatnam, Shanti, Bhosale, Prasad, Mochizuki, Shogo, Zhang, Jingyun, Sankarapandian, M., Wynne, Jean, Loubet, Nicolas, Basker, Veeraraghavan S, Guo, Dechao, Haran, Bala, Bu, Huiming

المصدر: 2020 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC),2020 IEEE International. :31-33 Oct, 2020

Relation: 2020 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: Wang, Miaomiao, Zhang, Jingyun, Zhou, Huimei, Southwick, Richard G., Kuo Chao, Robin Hsin, Miao, Xin, Basker, Veeraraghavan S., Yamashita, Tenko, Guo, Dechao, Karve, Gauri, Bu, Huiming, Stathis, James H.

المصدر: 2019 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2019 IEEE International. :1-6 Mar, 2019

Relation: 2019 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: George, A. M.^Aff11, Veeraraghavan, S.^Aff11

المساهمون: di Prisco, Marco, Series Editor^Aff1, Chen, Sheng-Hong, Series Editor^Aff2, Vayas, Ioannis, Series Editor^Aff3, Kumar Shukla, Sanjay, Series Editor^Aff4, Sharma, Anuj, Series Editor^Aff5, Kumar, Nagesh, Series Editor^Aff6, Wang, Chien Ming, Series Editor^Aff7, Shrikhande, Manish, editor^Aff8, Agarwal, Pankaj, editor^Aff9, Kumar, P. C. Ashwin, editor^Aff10

المصدر: Proceedings of 17th Symposium on Earthquake Engineering (Vol. 3). 331:77-88

المؤلفون: Veeraraghavan, S, Kumaravel, M, Vasudevan, Krishna, Jhunjhunwala, Ashok

المصدر: 2014 IEEE 40th Photovoltaic Specialist Conference (PVSC) Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th. :3713-3718 Jun, 2014

Relation: 2014 IEEE 40th Photovoltaic Specialists Conference (PVSC)

المؤلفون: Zhang, Jingyun, Ando, Takashi, Yeung, Chun Wing, Wang, Miaomiao, Kwon, Ohseong, Galatage, Rohit, Chao, Robin, Loubet, Nicolas, Moon, Bum Ki, Bao, Ruqiang, Vega, Reinaldo A., Li, Juntao, Zhang, Chen, Liu, Zuoguang, Kang, Myunggil, Miao, Xin, Wang, Junli, Kanakasabapathy, Sivananda, Basker, Veeraraghavan S., Jagannathan, Hemanth, Yamashita, Tenko

المصدر: 2017 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2017 IEEE International. :22.1.1-22.1.4 Dec, 2017

Relation: 2017 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Veeraraghavan, S., Srinivasan, K.

المصدر: HEALTHCOM 2006 8th International Conference on e-Health Networking, Applications and Services e-Health Networking, Applications and Services, 2006. HEALTHCOM 2006. 8th International Conference on. :180-183 2006

Relation: HEALTHCOM 2006 8th International Conference on e-Health Networking, Applications and Services

المؤلفون: Wu, W., Li, X., Wang, H., Gildenblat, G., Workman, G., Veeraraghavan, S., McAndrew, C.

المصدر: Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005. Custom Integrated Circuits Custom Integrated Circuits Conference, 2005. Proceedings of the IEEE 2005. :819-822 2005

Relation: Proceedings of the IEEE 2005 Custom Integrated Circuits Conference

المؤلفون: Jallepalli, S., Srivastava, A., Wyllie, R., Veeraraghavan, S.

المصدر: IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 26(3):385-392 Aug, 2013