المؤلفون: Vandooren, A., Witters, L., Franco, J., Mallik, A., Parvais, B., Wu, Z., Li, W., Rosseel, E., Hikkavyy, A., Peng, L., Rassoul, N., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Waldron, N., Boemmels, J., De Heyn, V., Mocuta, D., Ryckaert, J., Collaert, N.

المصدر: 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2018 IEEE. :1-4 Oct, 2018

Relation: 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

المؤلفون: Vandooren, A., Witters, L., Franco, J., Mallik, A., Parvais, B., Wu, Z., Walke, A., Deshpande, V., Rosseel, E., Hikavyy, A., Li, W., Peng, L., Rassoul, N., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Waldron, N., De Heyn, V., Mocuta, D., Collaert, N.

المصدر: 2018 International Conference on IC Design & Technology (ICICDT) IC Design & Technology (ICICDT), 2018 International Conference on. :145-148 Jun, 2018

Relation: 2018 International Conference on IC Design & Technology (ICICDT)

المؤلفون: Vandooren, A., Franco, J., Parvais, B., Wu, Z., Witters, L., Walke, A., Li, W., Peng, L., Deshpande, V., Bufler, F.M., Rassoul, N., Hellings, G., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Rosseel, E., Vanherle, W., Hikavyy, A., Chan, B.T., Ritzenthaler, R., Besnard, G., Schwarzenbach, W., Gaudin, G., Radu, I., Nguyen, B., Waldron, N., De Heyn, V., Mocuta, D., Collaert, N.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 65(11):5165-5171 Nov, 2018

المؤلفون: Vandooren, A., Franco, J., Parvais, B., Wu, Z., Witters, L., Walke, A., Li, W., Peng, L., Desphande, V., Bufler, F.M., Rassoul, N., Hellings, G., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Rosseel, E., Vanherle, W., Hikavyy, A., Chan, B. T., Ritzenthaler, R., Besnard, G., Schwarzenbach, W., Gaudin, G., Radu, I., Nguyen, B.-Y., Waldron, N., Heyn, V. De, Mocuta, D., Collaert, N.

المصدر: 2018 IEEE Symposium on VLSI Technology VLSI Technology, 2018 IEEE Symposium on. :69-70 Jun, 2018

Relation: 2018 IEEE Symposium on VLSI Technology

المؤلفون: Jourdain, A., Phommahaxay, A., Verbinnen, G., Suhard, S., Miller, A., Manna, A. La, Swinnen, B., Beyer, G., Beyne, E.

المصدر: 2012 4th Electronic System-Integration Technology Conference Electronic System-Integration Technology Conference (ESTC), 2012 4th. :1-4 Sep, 2012

Relation: 2012 4th Electronic System-Integration Technology Conference (ESTC)

المؤلفون: Buisson, T., Potoms, G., Phommahaxay, A., Verbinnen, G., Jaenen, P., La Manna, A., Travaly, Y., Beyne, E.

المصدر: 2011 IEEE 13th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th. :25-28 Dec, 2011

Relation: 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)

المؤلفون: Alapati, R., Travaly, Y., Van Olmen, J., Teixeira, R.C., Vaes, J., van Cauwenbergh, M., Jourdain, A., Verbinnen, G., Marcuccilli, G., Florence, G., Wolfling, S., Pelissier, C., Haiping Zhang, Sinha, J., Machura, A., Malik, I.

المصدر: 2009 IEEE International Conference on 3D System Integration; 2009, p1-4, 4p

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