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1مؤتمر
المؤلفون: Andone, Diana, Vasiu, Radu, Mihaescu, Vlad, Vert, Silviu, Ternauciuc, Andrei, Mocofan, Muguras
المصدر: 2024 IEEE Global Engineering Education Conference (EDUCON) Global Engineering Education Conference (EDUCON), 2024 IEEE. :1-8 May, 2024
Relation: 2024 IEEE Global Engineering Education Conference (EDUCON)
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2مؤتمر
المؤلفون: Orhei, Ciprian, Radu, Lucian, Mocofan, Muguras, Vert, Silviu, Vasiu, Radu
المصدر: 2022 International Symposium on Electronics and Telecommunications (ISETC) Electronics and Telecommunications (ISETC), 2022 International Symposium on. :1-4 Nov, 2022
Relation: 2022 International Symposium on Electronics and Telecommunications (ISETC)
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3مؤتمر
المؤلفون: Tataru, Marius, Berzescu, Silviu, Vert, Silviu, Mihaescu, Vlad, Stamatoiu, Radu, Vasiu, Radu
المصدر: 2022 International Symposium on Electronics and Telecommunications (ISETC) Electronics and Telecommunications (ISETC), 2022 International Symposium on. :1-4 Nov, 2022
Relation: 2022 International Symposium on Electronics and Telecommunications (ISETC)
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4مؤتمر
المؤلفون: Andone, Diana, Vasiu, Radu, Bogdan, Razvan, Mihaescu, Vlad, Vert, Silviu, Iovanovici, Alexandru, Ciupe, Valentin, Dragan, Florin
المصدر: 2022 IEEE Global Engineering Education Conference (EDUCON) Global Engineering Education Conference (EDUCON), 2022 IEEE. :1480-1489 Mar, 2022
Relation: 2022 IEEE Global Engineering Education Conference (EDUCON)
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5مؤتمر
المؤلفون: Mihaescu, Vlad, Andone, Diana, Vert, Silviu, Ternauciuc, Andrei, Vasiu, Radu
المصدر: 2022 International Conference on Advanced Learning Technologies (ICALT) ICALT Advanced Learning Technologies (ICALT), 2022 International Conference on. :33-35 Jul, 2022
Relation: 2022 International Conference on Advanced Learning Technologies (ICALT)
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6مؤتمر
المؤلفون: Orhei, Ciprian, Radu, Lucian, Mocofan, Muguras, Vert, Silviu, Vasiu, Radu
المصدر: 2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2021 IEEE 27th International Symposium for. :218-221 Oct, 2021
Relation: 2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)
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7مؤتمر
المؤلفون: Orhei, Ciprian, Mocofan, Muguras, Vert, Silviu, Vasiu, Radu
المصدر: 2021 44th International Conference on Telecommunications and Signal Processing (TSP) Telecommunications and Signal Processing (TSP), 2021 44th International Conference on. :292-295 Jul, 2021
Relation: 2021 44th International Conference on Telecommunications and Signal Processing (TSP)
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8مؤتمر
المؤلفون: Andone, Diana, Mihaescu, Vlad, Ternauciuc, Andrei, Vert, Silviu, Vasiu, Radu, Mocofan, Mugur
المصدر: 2021 IEEE Global Engineering Education Conference (EDUCON) Global Engineering Education Conference (EDUCON), 2021 IEEE. :1056-1060 Apr, 2021
Relation: 2021 IEEE Global Engineering Education Conference (EDUCON)
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9مؤتمر
المؤلفون: Orhei, Ciprian, Mocofan, Muguras, Vert, Silviu, Vasiu, Radu
المصدر: 2020 International Symposium on Electronics and Telecommunications (ISETC) Electronics and Telecommunications (ISETC), 2020 International Symposium on. :1-4 Nov, 2020
Relation: 2020 International Symposium on Electronics and Telecommunications (ISETC)
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10مؤتمر
المؤلفون: Andone, Diana, Ternauciuc, Andrei, Vert, Silviu, Mocofan, Muguras, Mihaescu, Vlad, Stoica, Daniela, Vasiu, Radu
المصدر: 2021 International Conference on Advanced Learning Technologies (ICALT) ICALT Advanced Learning Technologies (ICALT), 2021 International Conference on. :17-19 Jul, 2021
Relation: 2021 International Conference on Advanced Learning Technologies (ICALT)
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