المؤلفون: Erfanijazi, H., Camunas-Mesa, L.A., Vianello, E., Serrano-Gotarredona, T., Linares-Barranco, B.

المصدر: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 71(8):3685-3689 Aug, 2024

المؤلفون: Martemucci, M., Rummens, F., Hirtzlin, T., Martin, S., Guille, O., Januel, T., Carabasse, C., Billoint, O., Laguerre, J., Coignus, J., Vincent, A. F., Querlioz, D., Grenouillet, L., Saighi, S., Vianello, E.

المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

Relation: 2023 International Electron Devices Meeting (IEDM)

المؤلفون: Turck, C., Bonnet, D., Harabi, K.-E., Dalgaty, T., Ballet, T., Hirtzlin, T., Pontlevy, A., Renaudineau, A., Esmanhotto, E., Bessiere, P., Droulez, J., Laurent, R., Bocquet, M., Portal, J.-M., Vianello, E., Querlioz, D.

المصدر: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

Relation: 2023 International Electron Devices Meeting (IEDM)

المؤلفون: Trabelsi, A., Cagli, C., Hirtzlin, T., Martin, S., Billoint, O., Vianello, E., Sousa, V., Bourgeois, G., Andrieu, F.

المصدر: 2023 IEEE International Integrated Reliability Workshop (IIRW) Integrated Reliability Workshop (IIRW), 2023 IEEE International. :1-4 Oct, 2023

Relation: 2023 IEEE International Integrated Reliability Workshop (IIRW)

المؤلفون: D'Agostino, S., Moro, F., Hirtzlin, T., Arcamone, J., Castellani, N., Querlioz, D., Payvand, M., Vianello, E.

المصدر: 2023 IEEE 5th International Conference on Artificial Intelligence Circuits and Systems (AICAS) Artificial Intelligence Circuits and Systems (AICAS), 2023 IEEE 5th International Conference on. :1-5 Jun, 2023

Relation: 2023 IEEE 5th International Conference on Artificial Intelligence Circuits and Systems (AICAS)

المؤلفون: Trabelsi, A., Cagli, C., Hirtzlin, T., Cueto, O., Cyrille, M. C., Vianello, E., Meli, V., Sousa, V., Bourgeois, G., Andrieu, F.

المصدر: ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC) Solid State Circuits Conference (ESSCIRC), ESSCIRC 2022- IEEE 48th European. :129-132 Sep, 2022

Relation: ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC)

المؤلفون: Moro, Filippo, Esmanhotto, E., Hirtzlin, T., Castellani, N., Trabelsi, A., Dalgaty, T., Molas, G., Andrieu, F., Brivio, S., Spiga, S., Indiveri, G., Payvand, M., Vianello, E.

المصدر: 2022 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2022 IEEE International Symposium on. :380-383 May, 2022

Relation: 2022 IEEE International Symposium on Circuits and Systems (ISCAS)

المؤلفون: Lopez, J. Minguet, Rummens, F., Reganaz, L., Heraud, A., Hirtzlin, T., Grenouillet, L., Navarro, G., Bernard, M., Carabasse, C., Castellani, N., Meli, V., Martin, S., Magis, T., Vianello, E., Sabbione, C., Deleruyelle, D., Bocquet, M., Portal, J. M., Molas, G., Andrieu, F.

المصدر: 2022 IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2022 IEEE International. :1-4 May, 2022

Relation: 2022 IEEE International Memory Workshop (IMW)

المؤلفون: Camunas-Mesa, L.A., Vianello, E., Reita, C., Serrano-Gotarredona, T., Linares-Barranco, B.

المصدر: IEEE Journal on Emerging and Selected Topics in Circuits and Systems IEEE J. Emerg. Sel. Topics Circuits Syst. Emerging and Selected Topics in Circuits and Systems, IEEE Journal on. 12(4):898-912 Dec, 2022

المؤلفون: Jebali, F., Muhr, E., Alayan, M., Faye, M.C., Querlioz, D., Andrieu, F., Vianello, E., Molas, G., Bocquet, M., Portal, J.M.

المصدر: 2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS) Microelectronic Test Structures (ICMTS), 2022 IEEE 34th International Conference on. :1-5 Mar, 2022

Relation: 2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS)