المؤلفون: Boehme, C., Vieroth, R., Hirvonen, Mervi

المصدر: Boehme, C, Vieroth, R & Hirvonen, M 2012, A novel packaging concept for electronics in textile UHF antennas . in Proceedings : 45th International Symposium on Microelectronics, IMAPS 2012 . vol. 1, Curran Associates Inc., Red Hook, NY, USA, pp. 425-432, 45th Annual International Symposium on Microelectronics, IMAPS 2012, San Diego, CA, United States, 9/09/12 .

مصطلحات موضوعية: BAN, textile antenna, NCA, wireless sensor node, ICA

URL الوصول: https://explore.openaire.eu/search/publication?articleId=355e65625b88::4d1d2dd2c1e39cb94b058201d168bc08
https://cris.vtt.fi/en/publications/ee31678e-de05-43a1-b461-419de20aa4e1

المؤلفون: Löher, T., Neumann, A., Vieroth, R., Ostmann, A., Reichl, H.

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::dc4b542d3d0383ca2fe2f492ed20759a

المؤلفون: Löher, T., Pahl, B., Haberland, J., Vieroth, R., Kallmeyer, C., Neumann, A., Böttcher, L., Ostmann, A., Aschenbrenner, R., Reichl, H.

المساهمون: Publica

URL الوصول: https://explore.openaire.eu/search/publication?articleId=od_______610::a202464c653b8f525cbbe8f4f0ebcb65
https://publica.fraunhofer.de/handle/publica/207871

المؤلفون: Vieroth, R., Loher, T., Seckel, M., Dils, C., Kallmayer, C., Ostmann, A., Reichl, H.

المصدر: 2009 International Symposium on Wearable Computers; 2009, p33-36, 4p

المؤلفون: Ostmann, A., Vieroth, R., Seckel, M., Loher, T., Reichl, H.

المصدر: 2009 4th International Microsystems, Packaging, Assembly & Circuits Technology Conference; 2009, p216-219, 4p

المؤلفون: Vieroth, R., Kallmayer, C., Aschenbrenner, R., Reichl, H.

المصدر: 11th Electronics Packaging Technology Conference, 2009. EPTC '09; 2009, p240-243, 4p

المؤلفون: Loher, T., Seckel, M., Vieroth, R., Dils, C., Kallmayer, C., Ostmann, A., Aschenbrenner, R., Reichl, H.

المصدر: 11th Electronics Packaging Technology Conference, 2009. EPTC '09; 2009, p893-898, 6p

المؤلفون: Loher, T., Vieroth, R., Seckel, M., Ostmann, A., Reichl, H.

المصدر: 2008 IEEE 9th VLSI Packaging Workshop of Japan; 2008, p9-12, 4p

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