المؤلفون: Rideau, D., Oussaiti, Y., Grebot, J., Helleboid, R., Lopez, A., Mugny, G., Bourreau, E., Golanski, D., Mamdy, B., Alause, H. Wehbe, Nicholson, I., Pellegrini, S., Vlimant, C.E., Agnew, M., Cazimajou, T., Pala, M., Saint-Martin, J., Dollfus, P.

المصدر: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2021 International Conference on. :293-296 Sep, 2021

Relation: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: Rideau, Denis, Oussaiti, Y., Grebot, J., Helleboid, R., Lopez, A., Mugny, G., Bourreau, E., Golanski, D., Mamdy, B., Alause, H. Wehbe, Nicholson, I., Pellegrini, S., Vlimant, C.E., Agnew, M., Cazimajou, T., Pala, M., Saint-Martin, Jérôme, Dollfus, P.

المساهمون: STMicroelectronics [Crolles] (ST-CROLLES), CEA-Direction des Energies (ex-Direction de l'Energie Nucléaire) (CEA-DES (ex-DEN)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA), Centre de Nanosciences et de Nanotechnologies (C2N), Université Paris-Saclay-Centre National de la Recherche Scientifique (CNRS), Sept. 27-29, 2021, Virtual conference Dallas, US, saint-martin, Jérôme

المصدر: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2021)
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2021), Sept. 27-29, 2021, Virtual conference Dallas, US, Sep 2021, Dallas, United States

مصطلحات موضوعية: [SPI.NANO] Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, [SPI.TRON] Engineering Sciences [physics]/Electronics, ComputingMilieux_MISCELLANEOUS, [SPI.TRON]Engineering Sciences [physics]/Electronics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::d32e5f7a9766259e3012029483f9da88
https://hal.archives-ouvertes.fr/hal-03374008