المؤلفون: Kumar, V., Sivakumar, R., Ghosh, J.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(7):1281-1291 Jul, 2024

المؤلفون: Haas, A., Schrage, B., Menze, G., Sieberg, P.M., Schramm, D.

المصدر: IEEE/ASME Transactions on Mechatronics IEEE/ASME Trans. Mechatron. Mechatronics, IEEE/ASME Transactions on. 29(2):1295-1305 Apr, 2024

المؤلفون: Bisht, Chitra, Kundu, Pratim

المصدر: 2023 IEEE 3rd International Conference on Smart Technologies for Power, Energy and Control (STPEC) Smart Technologies for Power, Energy and Control (STPEC), 2023 IEEE 3rd International Conference on. :1-6 Dec, 2023

Relation: 2023 IEEE 3rd International Conference on Smart Technologies for Power, Energy and Control (STPEC)

المؤلفون: Joyce, Josephine Eskaline, Sebastian, Shoney

المصدر: 2023 Global Conference on Information Technologies and Communications (GCITC) Information Technologies and Communications (GCITC), 2023 Global Conference on. :1-7 Dec, 2023

Relation: 2023 Global Conference on Information Technologies and Communications (GCITC)

المؤلفون: Herath, Isuru Pathum, Jayawardena, Samuditha, Fadhil, Ahamed, Kodagoda, Nuwan, Arachchillage, Udara Srimath S.Samaratunge

المصدر: 2023 25th International Multitopic Conference (INMIC) Multitopic Conference (INMIC), 2023 25th International. :1-6 Nov, 2023

Relation: 2023 25th International Multitopic Conference (INMIC)

المؤلفون: Chen, Bin, Xu, Xinxin, Wang, Yue, Yang, Zhuo, Liu, Chunhua, Zhang, Tao^{Aff1, IDs11571023099962_cor6}

المصدر: Cognitive Neurodynamics. 18(4):1563-1574

المؤلفون: SV, Anshio, K, Abinesh, S, Jayanth, M, Ms. KANTHIMATHI

المصدر: 2023 7th International Conference on Trends in Electronics and Informatics (ICOEI) Trends in Electronics and Informatics (ICOEI), 2023 7th International Conference on. :492-496 Apr, 2023

Relation: 2023 7th International Conference on Trends in Electronics and Informatics (ICOEI)

المؤلفون: Varshita Reddy, Penaka Sai, Kalki, Tripuram Pavani, Roshini, P, Navaneethan, S.

المصدر: 2023 International Conference on Artificial Intelligence and Knowledge Discovery in Concurrent Engineering (ICECONF) Artificial Intelligence and Knowledge Discovery in Concurrent Engineering (ICECONF), 2023 International Conference on. :1-6 Jan, 2023

Relation: 2023 International Conference on Artificial Intelligence and Knowledge Discovery in Concurrent Engineering (ICECONF)

المؤلفون: Zhang, Xizhe, Yu, Demin, Liu, Min, Wang, Zhongjie

المصدر: 2022 IEEE International Conference on Edge Computing and Communications (EDGE) EDGE Edge Computing and Communications (EDGE), 2022 IEEE International Conference on. :133-142 Jul, 2022

Relation: 2022 IEEE International Conference on Edge Computing and Communications (EDGE)

المؤلفون: Park, Sungjune, Hwi Choi, Dae, Uk Kim, Jung, Ro, Yong Man

المصدر: ICASSP 2022 - 2022 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) Acoustics, Speech and Signal Processing (ICASSP), ICASSP 2022 - 2022 IEEE International Conference on. :4468-4472 May, 2022

Relation: ICASSP 2022 - 2022 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)