-
1دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
2
المصدر: Science, Technology and Development. 34:101-104
مصطلحات موضوعية: General Medicine
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d3f1e7ab151111f7b98a74ac57d58613
https://doi.org/10.3923/std.2015.101.104 -
3
المؤلفون: R. Chan, Ernest E.S. Ong, Mohd Zulkifly Abdullah, W.K. Loh, C.K. Ooi, C. Y. Khor
المصدر: Microelectronic Engineering. 113:40-49
مصطلحات موضوعية: Materials science, Through-silicon via, Epoxy, Condensed Matter Physics, Chip, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, visual_art, Fluid–structure interaction, Fluent, Fluid dynamics, visual_art.visual_art_medium, von Mises yield criterion, Potential flow, Electrical and Electronic Engineering, Composite material
-
4دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
5دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
6دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
7
المؤلفون: W.K. Loh, C.K. Ooi, R. Chan, Mohd Zulkifly Abdullah, Ernest E.S. Ong
المصدر: Microelectronics Reliability. 53:600-611
مصطلحات موضوعية: Void (astronomy), Materials science, business.industry, Mechanical engineering, Three-dimensional integrated circuit, Structural engineering, Epoxy, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Encapsulation (networking), Rheology, visual_art, Viscous flow, visual_art.visual_art_medium, Fluid dynamics, von Mises yield criterion, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, business
-
8
المؤلفون: W.K. Loh, C.K. Ooi, W.C. Leong, Ernest E.S. Ong, Mohd Zulkifly Abdullah, C. Y. Khor, R. Chan
المصدر: Engineering Applications of Computational Fluid Mechanics. 7:210-222
مصطلحات موضوعية: Engineering drawing, Materials science, General Computer Science, Through-silicon via, Numerical analysis, Three-dimensional integrated circuit, Numerical modeling, Mechanical engineering, Epoxy, Filling rate, Modeling and Simulation, visual_art, visual_art.visual_art_medium, Fluent, Flip chip
-
9
المؤلفون: C.K. Ooi, Mohd Zulkifly Abdullah, W.K. Loh, R. Chan, C. Y. Khor, Ernest E.S. Ong
المصدر: International Communications in Heat and Mass Transfer. 39:1616-1623
مصطلحات موضوعية: Materials science, Computer simulation, business.industry, General Chemical Engineering, Nanotechnology, Epoxy, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Encapsulation (networking), visual_art, Data presentation, Fluent, visual_art.visual_art_medium, Optoelectronics, business
-
10
المؤلفون: A.N.R. Wagiman, W.K. Loh, Yek Ban Liew, Mohd Nasir Tamin
المصدر: IEEE Transactions on Components and Packaging Technologies. 30:824-829
مصطلحات موضوعية: Surface-mount technology, Materials science, business.industry, Stress–strain curve, Structural engineering, Temperature cycling, Electronic, Optical and Magnetic Materials, Shear (sheet metal), Soldering, Shear stress, Electrical and Electronic Engineering, Deformation (engineering), business, Joint (geology)