المؤلفون: Zhong Xinzi, Cao Liyun, Huang Jianfeng, Liu Yijun, Ouyang Haibo, Wang Qinggang

المصدر: Processing and Application of Ceramics, Vol 16, Iss 2, Pp 183-190 (2022)

مصطلحات موضوعية: ceramic plate, reinforcement, processing, mechanical properties, Clay industries. Ceramics. Glass, TP785-869

وصف الملف: electronic resource

Relation: https://doaj.org/toc/1820-6131; https://doaj.org/toc/2406-1034

URL الوصول: https://doaj.org/article/e510b008647645198d68d62056a80dcd

المؤلفون: Huang, Yu, Zheng, Long, Liu, Haifeng, Zhou, Zhuoran, Chen, Dan, Yao, Pengcheng, Wang, Qinggang, Liao, Xiaofei, Jin, Hai

المصدر: 2023 60th ACM/IEEE Design Automation Conference (DAC) Design Automation Conference (DAC), 2023 60th ACM/IEEE. :1-6 Jul, 2023

Relation: 2023 60th ACM/IEEE Design Automation Conference (DAC)

المؤلفون: Zheng, Long, Ye, Xiangyu, Liu, Haifeng, Wang, Qinggang, Huang, Yu, Gui, Chuangyi, Yao, Pengcheng, Liao, Xiaofei, Jin, Hai, Xue, Jingling

المصدر: 2023 IEEE 39th International Conference on Data Engineering (ICDE) ICDE Data Engineering (ICDE), 2023 IEEE 39th International Conference on. :53-66 Apr, 2023

Relation: 2023 IEEE 39th International Conference on Data Engineering (ICDE)

المؤلفون: Wang, Qinggang, Zheng, Long, Hu, Ao, Huang, Yu, Yao, Pengcheng, Gui, Chuangyi, Liao, Xiaofei, Jin, Hai, Xue, Jingling

المصدر: 2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO) MICRO Microarchitecture (MICRO), 2022 55th IEEE/ACM International Symposium on. :1326-1341 Oct, 2022

Relation: 2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO)

المؤلفون: Sun, Yufei, Zheng, Long, Wang, Qinggang, Ye, Xiangyu, Huang, Yu, Yao, Pengcheng, Liao, Xiaofei, Jin, Hai

المصدر: 2022 IEEE High Performance Extreme Computing Conference (HPEC) High Performance Extreme Computing Conference (HPEC), 2022 IEEE. :1-7 Sep, 2022

Relation: 2022 IEEE High Performance Extreme Computing Conference (HPEC)

المؤلفون: Li, Zhiyong, Ming, Tingzhen^{Aff1, Aff2, IDs1163002419548_cor2}, Zhang, Heyu, Zhao, Sitong, Wang, Qinggang, Cai, Cunjin, Yin, Kui, Fang, Yueping, Wu, Yongjia^{Aff1, Aff2, IDs1163002419548_cor9}

المصدر: Journal of Thermal Science. 33(2):396-407

المؤلفون: Chen, Dan, Jin, Hai, Zheng, Long, Huang, Yu, Yao, Pengcheng, Gui, Chuangyi, Wang, Qinggang, Liu, Haifeng, He, Haiheng, Liao, Xiaofei, Zheng, Ran

المصدر: 2022 IEEE International Parallel and Distributed Processing Symposium (IPDPS) IPDPS Parallel and Distributed Processing Symposium (IPDPS), 2022 IEEE International. :246-257 May, 2022

Relation: 2022 IEEE International Parallel and Distributed Processing Symposium (IPDPS)

المؤلفون: Yao, Pengcheng, Zheng, Long, Huang, Yu, Wang, Qinggang, Gui, Chuangyi, Zeng, Zhen, Liao, Xiaofei, Jin, Hai, Xue, Jingling

المصدر: 2022 IEEE International Symposium on High-Performance Computer Architecture (HPCA) HPCA High-Performance Computer Architecture (HPCA), 2022 IEEE International Symposium on. :199-212 Apr, 2022

Relation: 2022 IEEE International Symposium on High-Performance Computer Architecture (HPCA)

المؤلفون: Huang, Yu, Zheng, Long, Yao, Pengcheng, Wang, Qinggang, Liao, Xiaofei, Jin, Hai, Xue, Jingling

المصدر: 2022 IEEE International Symposium on High-Performance Computer Architecture (HPCA) HPCA High-Performance Computer Architecture (HPCA), 2022 IEEE International Symposium on. :1029-1042 Apr, 2022

Relation: 2022 IEEE International Symposium on High-Performance Computer Architecture (HPCA)

المؤلفون: Wang, Qinggang, Zheng, Long, Yuan, Jingrui, Huang, Yu, Yao, Pengcheng, Gui, Chuangyi, Hu, Ao, Liao, Xiaofei, Jin, Hai

المصدر: 2022 IEEE International Symposium on High-Performance Computer Architecture (HPCA) HPCA High-Performance Computer Architecture (HPCA), 2022 IEEE International Symposium on. :184-198 Apr, 2022

Relation: 2022 IEEE International Symposium on High-Performance Computer Architecture (HPCA)