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1دورية أكاديمية
المؤلفون: Zhong Xinzi, Cao Liyun, Huang Jianfeng, Liu Yijun, Ouyang Haibo, Wang Qinggang
المصدر: Processing and Application of Ceramics, Vol 16, Iss 2, Pp 183-190 (2022)
مصطلحات موضوعية: ceramic plate, reinforcement, processing, mechanical properties, Clay industries. Ceramics. Glass, TP785-869
وصف الملف: electronic resource
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2مؤتمر
المؤلفون: Huang, Yu, Zheng, Long, Liu, Haifeng, Zhou, Zhuoran, Chen, Dan, Yao, Pengcheng, Wang, Qinggang, Liao, Xiaofei, Jin, Hai
المصدر: 2023 60th ACM/IEEE Design Automation Conference (DAC) Design Automation Conference (DAC), 2023 60th ACM/IEEE. :1-6 Jul, 2023
Relation: 2023 60th ACM/IEEE Design Automation Conference (DAC)
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3مؤتمر
المؤلفون: Zheng, Long, Ye, Xiangyu, Liu, Haifeng, Wang, Qinggang, Huang, Yu, Gui, Chuangyi, Yao, Pengcheng, Liao, Xiaofei, Jin, Hai, Xue, Jingling
المصدر: 2023 IEEE 39th International Conference on Data Engineering (ICDE) ICDE Data Engineering (ICDE), 2023 IEEE 39th International Conference on. :53-66 Apr, 2023
Relation: 2023 IEEE 39th International Conference on Data Engineering (ICDE)
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4مؤتمر
المؤلفون: Wang, Qinggang, Zheng, Long, Hu, Ao, Huang, Yu, Yao, Pengcheng, Gui, Chuangyi, Liao, Xiaofei, Jin, Hai, Xue, Jingling
المصدر: 2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO) MICRO Microarchitecture (MICRO), 2022 55th IEEE/ACM International Symposium on. :1326-1341 Oct, 2022
Relation: 2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO)
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5مؤتمر
المؤلفون: Sun, Yufei, Zheng, Long, Wang, Qinggang, Ye, Xiangyu, Huang, Yu, Yao, Pengcheng, Liao, Xiaofei, Jin, Hai
المصدر: 2022 IEEE High Performance Extreme Computing Conference (HPEC) High Performance Extreme Computing Conference (HPEC), 2022 IEEE. :1-7 Sep, 2022
Relation: 2022 IEEE High Performance Extreme Computing Conference (HPEC)
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6دورية أكاديمية
المؤلفون: Li, Zhiyong, Ming, TingzhenAff1, Aff2, IDs1163002419548_cor2, Zhang, Heyu, Zhao, Sitong, Wang, Qinggang, Cai, Cunjin, Yin, Kui, Fang, Yueping, Wu, YongjiaAff1, Aff2, IDs1163002419548_cor9
المصدر: Journal of Thermal Science. 33(2):396-407
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7مؤتمر
المؤلفون: Chen, Dan, Jin, Hai, Zheng, Long, Huang, Yu, Yao, Pengcheng, Gui, Chuangyi, Wang, Qinggang, Liu, Haifeng, He, Haiheng, Liao, Xiaofei, Zheng, Ran
المصدر: 2022 IEEE International Parallel and Distributed Processing Symposium (IPDPS) IPDPS Parallel and Distributed Processing Symposium (IPDPS), 2022 IEEE International. :246-257 May, 2022
Relation: 2022 IEEE International Parallel and Distributed Processing Symposium (IPDPS)
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8مؤتمر
المؤلفون: Yao, Pengcheng, Zheng, Long, Huang, Yu, Wang, Qinggang, Gui, Chuangyi, Zeng, Zhen, Liao, Xiaofei, Jin, Hai, Xue, Jingling
المصدر: 2022 IEEE International Symposium on High-Performance Computer Architecture (HPCA) HPCA High-Performance Computer Architecture (HPCA), 2022 IEEE International Symposium on. :199-212 Apr, 2022
Relation: 2022 IEEE International Symposium on High-Performance Computer Architecture (HPCA)
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9مؤتمر
المؤلفون: Huang, Yu, Zheng, Long, Yao, Pengcheng, Wang, Qinggang, Liao, Xiaofei, Jin, Hai, Xue, Jingling
المصدر: 2022 IEEE International Symposium on High-Performance Computer Architecture (HPCA) HPCA High-Performance Computer Architecture (HPCA), 2022 IEEE International Symposium on. :1029-1042 Apr, 2022
Relation: 2022 IEEE International Symposium on High-Performance Computer Architecture (HPCA)
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10مؤتمر
المؤلفون: Wang, Qinggang, Zheng, Long, Yuan, Jingrui, Huang, Yu, Yao, Pengcheng, Gui, Chuangyi, Hu, Ao, Liao, Xiaofei, Jin, Hai
المصدر: 2022 IEEE International Symposium on High-Performance Computer Architecture (HPCA) HPCA High-Performance Computer Architecture (HPCA), 2022 IEEE International Symposium on. :184-198 Apr, 2022
Relation: 2022 IEEE International Symposium on High-Performance Computer Architecture (HPCA)