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1دورية أكاديمية
المؤلفون: Bai, Yifan, Yang, WeiminAff1, Aff2, IDs1070602402897z_cor2, Shi, Baohui, Liu, Lang, Wang, MeixiaAff4, IDs1070602402897z_cor5, Wang, Senwei, Song, Xuan, Tian, Cong
المصدر: Geotechnical and Geological Engineering: An International Journal. :1-18
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2مؤتمر
المؤلفون: Yuncu, Goksel, Akkus, Yigit, Dursunkaya, Zafer
المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-6 May, 2023
Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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3دورية أكاديمية
المؤلفون: Dissanayake, JanithAff1, Aff2, Kang, Sung Bong, Park, Jihoon, Yinbao, Fang, Park, SungryulAff4, IDs44211024005408_cor5, Lee, Min-HoAff5, IDs44211024005408_cor6
المصدر: Analytical Sciences. 40(5):907-915
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4دورية أكاديمية
المؤلفون: Chen, GuoqiangAff1, IDs12010023046218_cor1, Zhou, ChunxiaoAff1, Aff2, Xing, Lili, Xing, Tieling
المصدر: Applied Biochemistry and Biotechnology. 196(4):1966-1976
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5مؤتمر
المؤلفون: Karami, Nooshin, Tessier-Poirier, Albert, Nikkhah, Alihossein, Leveille, Etienne, Frechette, Luc G.
المصدر: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2022 28th International Workshop on. :1-5 Sep, 2022
Relation: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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6دورية أكاديمية
المؤلفون: Yan, Jiawei, Kumar, Vijay, Gao, Tianshuo, Shi, Jian, Kim, IcksooAff1, Aff3, Aff4, Morikawa, HideakiAff1, Aff3, Aff4, Zhu, ChunhongAff1, Aff3, Aff4, IDs12221023004566_cor7
المصدر: Fibers and Polymers. 25(2):703-711
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7
المؤلفون: Suo, Si, Habibi Khorasani, Seyed Morteza, Bagheri, Shervin, 1979
المصدر: Journal of Fluid Mechanics. 992
مصطلحات موضوعية: breakup/coalescence, drops, wetting and wicking
وصف الملف: print
URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-352994
https://doi.org/10.1017/jfm.2024.416 -
8مؤتمر
المؤلفون: Li, Zaibo, Zhang, Yongping
المصدر: 2021 3rd International Academic Exchange Conference on Science and Technology Innovation (IAECST) Science and Technology Innovation (IAECST), 2021 3rd International Academic Exchange Conference on. :1068-1072 Dec, 2021
Relation: 2021 3rd International Academic Exchange Conference on Science and Technology Innovation (IAECST)
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9مؤتمرA Screen-Printed Stretchable Bioelectrical Sensing Sleeve with QuasiDry Microfluid-Wicking Interface
المؤلفون: Zheng, Mingde, Zarra, Salvatore, Samanta, Bibek R.
المصدر: 2021 IEEE Sensors Sensors, 2021 IEEE Sensors. :1-4 Oct, 2021
Relation: 2021 IEEE Sensors
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10دورية أكاديمية
المصدر: Cogent Engineering, Vol 11, Iss 1 (2024)
مصطلحات موضوعية: Fabric layers, moisture-wicking, wicking growth rate, wicking length, wicking height, yarn bundles, Engineering (General). Civil engineering (General), TA1-2040
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2331-1916