المؤلفون: Winkel, T.-M., Deutsch, A., Katopis, G.A., Kopcsay, G.V., Klink, E., Dyckman, W.D., Chamberlin, B.J., Grabinski, H., Surovic, C.W., Liu, H., Baks, C.

المصدر: IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. Electrical Performance of Electronic Packaging Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on. :21-24 2005

Relation: Electrical Performance of Electronic Packaging

المؤلفون: Winkel, T.-M., Ktata, M.F., Ludwig, T., Grabinski, H., Klink, E.

المصدر: Electrical Performance of Electronic Packaging - 2004 Electronic packaging Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on. :131-134 2004

Relation: Electrical Performance of Electronic Packaging

المؤلفون: Winkel, T.-M., Ktata, M.F., Ludwig, T., Schettler, H., Grabinski, H., Klink, E.

المصدر: Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 2003. :97-100 2003

Relation: Electrical Performance of Electronic Packaging

المؤلفون: Deutsch, A., Winkel, T.-M., Kopcsay, G.V., Surovic, C.W., Rubin, B.J., Katopis, G.A., Chamberlin, B.J.

المصدر: Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 2003. :235-238 2003

Relation: Electrical Performance of Electronic Packaging

المؤلفون: Deutsch, A., Huber, A., Kopcsay, G.V., Rubin, B.J., Hemedinger, R., Carey, D., Becker, W., Winkel, T.-M., Chamberlin, B.

المصدر: 2002 IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on. :311-314 2002

Relation: IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging

المؤلفون: Rimolo-Donadio, R., Supper, J., Winkel, T.-M., Harrer, H., Schuster, C.

المصدر: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 54(2):495-498 Apr, 2012

المؤلفون: Winkel, T.-M.

المصدر: IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 1999. :133-136 1999

Relation: IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging

المؤلفون: Deutsch, A., Krabbenhoft, R. S., Melde, K. L., Surovic, C. W., Katopis, G. A., Kopcsay, G. V., Zhou, Z. V., Chen, Z. V., Kwark, Y. H., Winkel, T. V., Gu, X. V., Standaert, T. E.

المصدر: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 52(2):266-287 May, 2010

المؤلفون: Winkel, T.-M., Dutta, L.S., Grabinski, H.

المصدر: 1997 IEEE MTT-S International Microwave Symposium Digest Microwave symposium Microwave Symposium Digest, 1997., IEEE MTT-S International. 3:1769-1772 vol.3 1997

Relation: 1997 IEEE MTT-S International Microwave Symposium Digest

المؤلفون: Winkel, T.-M., Dutta, L.S., Grabinski, H., Groteluschen, E.

المصدر: Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893) Multi-chip modules Multi-Chip Module Conference, 1996. MCMC-96, Proceedings., 1996 IEEE. :99-104 1996

Relation: Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)