المؤلفون: West, J.T., Kurlej, A., Wynn, A., Rogers, C., Gouker, M.A., Tolpygo, S.K.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 32(5):1-12 Aug, 2022

المؤلفون: Yu, X., Chen, X., Milosevic, M.M., Yan, X., Saito, S., Reed, G.T.

المصدر: IEEE Photonics Journal IEEE Photonics J. Photonics Journal, IEEE. 12(5):1-8 Oct, 2020

المؤلفون: Hofrichter, Jens, Green, William M. J., Horst, Folkert, Assefa, Solomon, Yang, Min, Offrein, Bert, Vlasov, Yurii

المصدر: 8th IEEE International Conference on Group IV Photonics Group IV Photonics (GFP), 2011 8th IEEE International Conference on. :127-129 Sep, 2011

Relation: 2011 IEEE 8th International Conference on Group IV Photonics (GFP)

المؤلفون: Xingshi Yu, Xia Chen, Milan M. Milosevic, Xingzhao Yan, Shinichi Saito, Graham T. Reed

المصدر: IEEE Photonics Journal, Vol 12, Iss 5, Pp 1-8 (2020)

مصطلحات موضوعية: Ion-implantation, Electrically erasable, Directional couplers, Mach-Zehnder Interferometer, Wafer scale testing, Applied optics. Photonics, TA1501-1820, Optics. Light, QC350-467

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/9210769/; https://doaj.org/toc/1943-0655

URL الوصول: https://doaj.org/article/ce50a892d09e487fa5e14d37937c5494

المؤلفون: Chow, E. M., Chua, C., Hantschel, T., Van Schuylenbergh, K., Fork, D. K.

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 29(4):796-803 Dec, 2006

المؤلفون: Reed, Graham T.

المصدر: 2015 2nd International Conference on Opto-Electronics and Applied Optics (IEM OPTRONIX) Opto-Electronics and Applied Optics (IEM OPTRONIX), 2015 2nd International Conference on. :1-1 Oct, 2015

Relation: 2015 2nd International Conference on Opto-Electronics and Applied Optics (IEM OPTRONIX)

المؤلفون: Michels, T., Aksyuk, V.

المصدر: IEEE Photonics Technology Letters IEEE Photon. Technol. Lett. Photonics Technology Letters, IEEE. 29(8):643-646 Apr, 2017

المؤلفون: Xingshi Yu, Xia Chen, Milan M. Milosevic, Weihong Shen, Rob Topley, Bigeng Chen, Xingzhao Yan, Wei Cao, David J. Thomson, Shinichi Saito, Anna C. Peacock, Otto L. Muskens, Graham T. Reed

المصدر: Micromachines, Vol 13, Iss 2, p 291 (2022)

مصطلحات موضوعية: silicon photonics, optical waveguide, Ge ion implantation, annealing, wafer-scale testing, post-fabrication trimming, Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2072-666X/13/2/291; https://doaj.org/toc/2072-666X

URL الوصول: https://doaj.org/article/3146429ca50f41d6be7653cb200015b6

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