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1مؤتمر
المؤلفون: Netzband, Christopher, Burns, Dylan, Tapily, Kandabara, Ilseok, Son, Wajda, Cory
المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :350-355 May, 2023
Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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2مؤتمر
المؤلفون: Triyoso, Dina H., Clark, Robert D., Consiglio, Steven, Tapily, Kandabara, Higuchi, Hisashi, Hakamata, Takahiro, Newman, Danny, Rogalskyj, Sophia, Cole, Christopher, Raley, Angelique, Wajda, Cory, Leusink, Gert
المصدر: 2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2020 4th IEEE. :1-4 Apr, 2020
Relation: 2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
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3مؤتمر
المؤلفون: Rogalskyj, Sophia, Frost, Hunter, Palka, Amber, Joy, Nicholas, Triyoso, Dina, Clark, Robert, Wajda, Cory, Leusink, Gert, Raley, Angelique, Dunn, Kathleen
المصدر: 2020 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC),2020 IEEE International. :49-51 Oct, 2020
Relation: 2020 IEEE International Interconnect Technology Conference (IITC)
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4مؤتمر
المؤلفون: Kikuchi, Yuki, Kawasaki, Hiroaki, Nagai, Hiroyuki, Kai-Hung Yu, Oie, Manabu, Consiglio, Steve, Wajda, Cory, Maekawa, Kaoru, Leusink, Gert
المصدر: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016 IEEE International. :99-101 May, 2016
Relation: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)
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5مؤتمر
المؤلفون: Clark, Robert, Tapily, Kanda, Yu, Kai-Hung, Hakamata, Takahiro, Consiglio, Steve, O'Meara, David, Wajda, Cory, Smith, Jeffrey, Leusink, Gert
المصدر: 2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) Electron Devices Technology and Manufacturing Conference (EDTM), 2018 IEEE 2nd. :100-101 Mar, 2018
Relation: 2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM)
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6دورية أكاديمية
المؤلفون: Dey, Sonal, Tapily, Kandabara, Consiglio, Steven, Yu, Kai-Hung, Clark, Robert D., Wajda, Cory S., Leusink, Gert J., Woll, Arthur R., Diebold, Alain C.
المصدر: MRS Advances. 1(4):269-274
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7دورية
المؤلفون: Zeinati, Aseel, Misra, Durga, Triyoso, Dina, Tapily, Kandabara, Clark, Robert D, Consiglio, Steven, Lombardo, Sarah, Wajda, Cory S, Leusink, Gert
المصدر: ECS Meeting Abstracts; 2024, Vol. MA2024-01 Issue 1, p3009-3009, 1p
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8دورية أكاديمية
المؤلفون: Dey, Sonal, Tapily, Kandabara, Consiglio, Steven, Clark, Robert D., Wajda, Cory S., Leusink, Gert J., Woll, Arthur R., Diebold, Alain C.
المصدر: Journal of Applied Physics; 2016, Vol. 120 Issue 12, p125304-1-125304-10, 10p, 1 Color Photograph, 1 Diagram, 3 Charts, 6 Graphs
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9دورية
المؤلفون: Consiglio, Steven, Higuchi, Hisashi, Ando, Takashi, Jamison, Paul, Seo, Soon-Cheon, Kong, Dexin, Kim, Youngseok, Tapily, Kandabara, Clark, Robert D, Hopstaken, Marinus, Cartier, Eduard, Tsunomura, Takaaki, Wajda, Cory S, Soave, Robert, Narayanan, Vijay, Leusink, Gert J
المصدر: ECS Transactions; May 2021, Vol. 102 Issue: 2 p19-28, 10p
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10مؤتمر
المؤلفون: Farrell, Richard A., Franke, Elliott, Tapily, Kanda, Hotalen, Jodi, O'Meara, David, Raley, Angelique, Ko, Akiteru, Biolsi, Peter, Wajda, Cory, Leusink, Gert, De Villiers, Anton, Hetzer, David
المصدر: Proceedings of SPIE; 1/14/2018, Vol. 10586, p1-9, 9p