المؤلفون: Zhao, Ri-an, Koskinen, Matthew, Liu, Yang, Wan, Xinggong

المصدر: 2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-6 Mar, 2023

Relation: 2023 IEEE International Reliability Physics Symposium (IRPS)

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المؤلفون: Zhao, Bing, Song, Wenhai, Wan, Xinggong, Sun, Yuping, Du, Jiaju ^*

المصدر: In Physica C: Superconductivity and its applications 2000 337(1):145-149

المؤلفون: Zhao, Bing, Wan, Xinggong, Song, Wenhai, Sun, Yuping, Du, Jiaju ^*

المصدر: In Physica C: Superconductivity and its applications 2000 337(1):138-144

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المؤلفون: Tang Yi, Gu Xiang, Liu Yuwei, Wang Wenyuan, Wan Xinggong, Zhang Huirui

المصدر: Journal of Semiconductors. 30:124005

مصطلحات موضوعية: Very-large-scale integration, Engineering, business.industry, Oxide, Condensed Matter Physics, Electronic, Optical and Magnetic Materials, Trap (computing), Stress (mechanics), chemistry.chemical_compound, chemistry, MOSFET, Materials Chemistry, Electronic engineering, Optoelectronics, Degradation (geology), Electrical and Electronic Engineering, Charge injection, business, Hot-carrier injection

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1d2671ac111b4c9464d9f5fb53891d98
https://doi.org/10.1088/1674-4926/30/12/124005

المؤلفون: Wan, Xinggong, Chen, Dianyong, Jiang, Yiming, Zhang, Hua, Li, Jin, Hua, Zhongyi

المصدر: Proceedings of SPIE; Nov2000 Part 2, Issue 1, p368-371, 4p

المؤلفون: Jiang, Yiming, Wan, Xinggong, Guo, Feng, Xie, Hengbo, Liu, Ping, Li, Jin

المصدر: Physica Status Solidi (A) - Applications and Materials Science; July 2005, Vol. 202 Issue: 9 p1804-1807, 4p

المؤلفون: Xie, Hengbo, Jiang, Yiming, Guo, Feng, Wan, Xinggong

المصدر: Physica Status Solidi (A) - Applications and Materials Science; January 2004, Vol. 201 Issue: 1 p111-114, 4p