المؤلفون: Hao, K., Ding, Y., Li, C., Wang, B., Liu, Y., Du, X., Wang, C.Q.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 21(4):5502-5511 Feb, 2021

المؤلفون: Wang, C.Q., Ji, Y.Q., Zhang, W.Y., Wang, J., Zhang, Z.M., Liu, Y.L., Dong, L., Xiu, X.M.

المصدر: In Results in Physics August 2024 63

المؤلفون: Peng, X., Zhou, Q., Wang, C.Q., Zhang, Z.M., Luo, Z., Xu, S.Y., Feng, B., Fang, Z.F., Lin, Y., Zhuo, Y., Jiang, X.M., Zhao, H, Tang, J.Y., Wu, D., Che, L.Q.

المصدر: In animal January 2024 18(1)

المؤلفون: Li, J.H., Yu, G.L., Wang, C.Q., Dou, Y.L., Yang, J.H., Zhu, Z.B., Stovall, J.

المصدر: In Results in Physics March 2023 46

المؤلفون: Wang, C.Q., Zhong, Y., Caers, J.F.J.M., Zhao, X.J., Li, B., Liu, B.L.

المصدر: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on. :1200-1204 Aug, 2012

Relation: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

المؤلفون: Li, P., Wang, C.Q., Fan, G.X., Liu, Y., Xiong, J.C.

المصدر: In Construction and Building Materials 1 February 2021 269

المؤلفون: Ding, Y., Wang, C.Q., Tian, Y.H.

المصدر: Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Electronic packaging technology Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on. :377-380 2003

Relation: ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings

المؤلفون: Wang, Z.B., Chiang, Y.K., Choy, Y.S., Wang, C.Q., Xi, Q.

المصدر: In Applied Acoustics May 2019 148:202-211

المؤلفون: Wang, C.Q., Xiong, J.J., Shenoi, R.A., Liu, M.D., Liu, J.Z.

المصدر: In International Journal of Fatigue February 2016 83 Part 2:280-287

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