المؤلفون: Wang, J., Wang, D.G., Li, X.T., Zhai, J.Q., Lu, G.X., Chen, C.Z.

المصدر: In Ceramics International August 2022

المؤلفون: Li, Y.P., Wang, D.G., Hu, A. P., Wang, W., Yao, Z.Q.

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Relation: 2010 International Conference on Power System Technology - (POWERCON 2010)

المؤلفون: Li, H.C., Wang, D.G., Hu, C., Dou, J.H., Yu, H.J., Chen, C.Z., Gu, G.C.

المصدر: In Applied Surface Science 15 May 2021 548

المؤلفون: Miller, S.W., Wang, D.G.

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Relation: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

المؤلفون: Wang, D.G., Knighten, J.L., Muller, P.K.

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Relation: Eighteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings 2002

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المصدر: In Surface & Coatings Technology 25 July 2020 394

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المصدر: Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) Electronics packaging technology Electronics Packaging Technology Conference, 1998. Proceedings of 2nd. :133-137 1998

Relation: Proceedings of 2nd Electronics Packaging Technology Conference

المؤلفون: Wang, D.G., Chen, C.Z., Yang, X.X., Ming, X.C., Zhang, W.L.

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المؤلفون: Wang, D.G., Zhang, W.L., Li, H.J., Zhang, J.H., Chen, C.Z.

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المؤلفون: Li, H.C., Wang, D.G., Chen, C.Z., Weng, F., Shi, H.

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