المؤلفون: Suga, Tadatomo, Wang, Junsha, Yamamura, Kazuya, Kataoka, Izumi

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :353-356 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Wang, Junsha, Suga, Tadatomo

المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :137-138 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

المؤلفون: Wang, Junsha, Takigawa, Ryo, Suga, Tadatomo

المصدر: 2022 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2022 IEEE. :57-60 Nov, 2022

Relation: 2022 IEEE CPMT Symposium Japan (ICSJ)

المؤلفون: Takeuchi, Kai, Higurashi, Eiji, Wang, Junsha, Yamauchi, Akira, Suga, Tadatomo

المصدر: 2022 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2022 IEEE. :61-64 Nov, 2022

Relation: 2022 IEEE CPMT Symposium Japan (ICSJ)

المؤلفون: Wang, Junsha, Suga, Tadatomo

المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :169-170 Apr, 2023

Relation: 2023 International Conference on Electronics Packaging (ICEP)

المؤلفون: Takeuchi, Kai, Wang, Junsha, Suga, Tadatomo, Kim, Beomjoon, Higurashi, Eiji

المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :173-174 Apr, 2023

Relation: 2023 International Conference on Electronics Packaging (ICEP)

المؤلفون: Wang, Junsha, Takeuchi, Kai, Kataoka, Izumi, Suga, Tadatomo

المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :57-58 May, 2022

Relation: 2022 International Conference on Electronics Packaging (ICEP)

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المؤلفون: Wang Junsha, Wan Long, Hao Suye, Chen Jing

المصدر: Science and Engineering of Composite Materials, Vol 24, Iss 2, Pp 271-278 (2017)

مصطلحات موضوعية: diamond, interface, polymer-matrix composites, surface modification, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: https://doaj.org/toc/0792-1233; https://doaj.org/toc/2191-0359

URL الوصول: https://doaj.org/article/53d13e5cb4444f2b989eaabe6132733b

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