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1مؤتمر
المؤلفون: Suga, Tadatomo, Wang, Junsha, Yamamura, Kazuya, Kataoka, Izumi
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :353-356 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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2مؤتمر
المؤلفون: Wang, Junsha, Suga, Tadatomo
المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :137-138 Apr, 2024
Relation: 2024 International Conference on Electronics Packaging (ICEP)
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3مؤتمر
المؤلفون: Wang, Junsha, Takigawa, Ryo, Suga, Tadatomo
المصدر: 2022 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2022 IEEE. :57-60 Nov, 2022
Relation: 2022 IEEE CPMT Symposium Japan (ICSJ)
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4مؤتمر
المؤلفون: Takeuchi, Kai, Higurashi, Eiji, Wang, Junsha, Yamauchi, Akira, Suga, Tadatomo
المصدر: 2022 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2022 IEEE. :61-64 Nov, 2022
Relation: 2022 IEEE CPMT Symposium Japan (ICSJ)
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5مؤتمر
المؤلفون: Wang, Junsha, Suga, Tadatomo
المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :169-170 Apr, 2023
Relation: 2023 International Conference on Electronics Packaging (ICEP)
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6مؤتمر
المؤلفون: Takeuchi, Kai, Wang, Junsha, Suga, Tadatomo, Kim, Beomjoon, Higurashi, Eiji
المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :173-174 Apr, 2023
Relation: 2023 International Conference on Electronics Packaging (ICEP)
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7مؤتمر
المؤلفون: Wang, Junsha, Takeuchi, Kai, Kataoka, Izumi, Suga, Tadatomo
المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :57-58 May, 2022
Relation: 2022 International Conference on Electronics Packaging (ICEP)
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8دورية أكاديمية
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تسجيل الدخول للوصول الكامل. -
9دورية أكاديمية
المؤلفون: Wang Junsha, Wan Long, Hao Suye, Chen Jing
المصدر: Science and Engineering of Composite Materials, Vol 24, Iss 2, Pp 271-278 (2017)
مصطلحات موضوعية: diamond, interface, polymer-matrix composites, surface modification, Materials of engineering and construction. Mechanics of materials, TA401-492
وصف الملف: electronic resource
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10دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.