المؤلفون: Wang, Shaoan, Xin, Zhanhua, Hu, Yaoqing, Li, Dongyue, Zhu, Mingzhu, Yu, Junzhi

مصطلحات موضوعية: Computer Science - Robotics, Computer Science - Computer Vision and Pattern Recognition

URL الوصول: http://arxiv.org/abs/2405.17278

المؤلفون: Huang, Tingting, Yang, Kexin, Wang, Puhan, Wang, Shaoan, Hao, Xiangyong, Li, Yongcheng

المصدر: 2023 IEEE 15th International Conference on Advanced Infocomm Technology (ICAIT) Advanced Infocomm Technology (ICAIT), 2023 IEEE 15th International Conference on. :152-156 Oct, 2023

Relation: 2023 IEEE 15th International Conference on Advanced Infocomm Technology (ICAIT)

المؤلفون: Wang, Shaoan, Zhu, Mingzhu, Hu, Yaoqing, Li, Dongyue, Yuan, Fusong, Yu, Junzhi

المصدر: IEEE Transactions on Visualization and Computer Graphics, 2024

مصطلحات موضوعية: Computer Science - Computer Vision and Pattern Recognition, Computer Science - Graphics, Computer Science - Robotics

URL الوصول: http://arxiv.org/abs/2310.13320

المؤلفون: Lin, Jiajun, Zheng, Yiming, Shao, Xianjun, Jin, Lingfeng, Wang, Shaohe, Chen, Xiaoxin, Wang, Shaoan

المصدر: 2022 IEEE 5th International Electrical and Energy Conference (CIEEC) Electrical and Energy Conference (CIEEC), 2022 IEEE 5th International. :358-361 May, 2022

Relation: 2022 IEEE 5th International Electrical and Energy Conference (CIEEC)

المؤلفون: Wang, Guangzhen, Zhao, Jun, Wang, ShaoAn, Gao, Shuguo, Yang, Qingzhu, Cheng, YangChun

المصدر: 2020 IEEE International Conference on High Voltage Engineering and Application (ICHVE) High Voltage Engineering and Application (ICHVE), 2020 IEEE International Conference on. :1-4 Sep, 2020

Relation: 2020 IEEE International Conference on High Voltage Engineering and Application (ICHVE)

المؤلفون: He, Yanliang, Shao, Xianjun, Wang, Shaoan, Shen, Zhiwei, Zhang, Xing, Sun, Anbang, Zhang, Guanjun

المصدر: 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) Electrical Insulation and Dielectric Phenomena (CEIDP), 2019 IEEE Conference on. :291-294 Oct, 2019

Relation: 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)

المؤلفون: Zhao, Lin, Ye, Liya, Wang, Shaoan, Zhan, Huamao, Yang, Yong, Jiang, Peng

المصدر: 2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM) Integrated Circuits and Microsystems (ICICM), 2018 IEEE 3rd International Conference on. :109-113 Nov, 2018

Relation: 2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM)

المؤلفون: Zhao, Lin, Ye, Liya, Wang, Shaoan, Yang, Yong, Jiang, Peng, Zou, Xiaofeng

المصدر: 2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM) Integrated Circuits and Microsystems (ICICM), 2018 IEEE 3rd International Conference on. :114-118 Nov, 2018

Relation: 2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM)

المؤلفون: Zhang, Shuye, Wang, Shaoan, Zhang, Shang, Chen, Xiangyu, Zeng, Chen, Paik, Kyung-Wook, He, Peng

المصدر: In Journal of Materials Research and Technology November-December 2023 27:7094-7099

المؤلفون: Wang, Shaoan, Chen, Xiangyu, Luo, Keyu, Zhou, Hongzhi, Li, Rongqing, He, Peng, Paik, Kyung-Wook, Zhang, Shuye

المصدر: In Journal of Materials Research and Technology November-December 2023 27:5332-5339