المؤلفون: Liu, Xu, Wang, Shaogang, Hu, Dong, Gao, Chenshan, Huang, Qianming, Ye, Huaiyu, French, Paddy, Zhang, Guoqi

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1119-1123 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Li, Shizhen, Liu, Xu, Gao, Chenshan, Wang, Shaogang, Li, Jun, Ye, Huaiyu, Zhang, Guoqi, Wu, Shaohui

المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-8 Apr, 2024

Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Wang, Shaogang, Zong, Qihang, Yang, Huiru, Huang, Qianming, Ye, Huaiyu, French, Paddy

المصدر: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2024 IEEE 37th International Conference on. :367-370 Jan, 2024

Relation: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)

المؤلفون: Zhou, Jingying, Li, Nayu, Yuan, Yuexiaozhou, Gao, Huiyan, Wang, Shaogang, Lu, Hang, Song, Chunyi, Kuan, Yen-Cheng, Gu, Qun Jane, Xu, Zhiwei

المصدر: 2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) Radio Frequency Integrated Circuits Symposium (RFIC), 2023 IEEE. :177-180 Jun, 2023

Relation: 2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)

المؤلفون: Jiang, Heng, Wang, Shaogang^{Aff1, IDs12666024032690_cor2}, Zhang, Wen

المصدر: Transactions of the Indian Institute of Metals. 77(6):1681-1689

المؤلفون: Zou, Chenglu, Zhao, Yan, Zhu, Gang^{Aff1, Aff2, Aff5}, Pang, Jianchao^{Aff1, IDs40195024016646_cor4}, Wang, Shaogang, Liu, Yangzhen, Liu, Feng^{Aff2, Aff4}, Li, Shouxin, Zhang, Zhefeng^{Aff1, IDs40195024016646_cor9}

المصدر: Acta Metallurgica Sinica (English Letters). 37(6):1077-1086

المؤلفون: Zhu, Jiuyi^{Aff1, Aff2}, Li, Fei, Hou, YuanZhen, Li, Hang, Xu, Dingxin, Tan, Junyang, Du, Jinhong, Wang, Shaogang, Liu, Zhengbo, Wu, HengAn, Wang, FengChao, Su, Yang^{Aff1, IDs41563024018400_cor12}, Cheng, Hui-Ming^{Aff4, Aff6, Aff7, IDs41563024018400_cor13}

المصدر: Nature Materials. 23(5):604-611

المؤلفون: Qu, Zhan^{Aff1, Aff2}, Zhang, Zhenjun^{Aff1, Aff2, IDs41586024070481_cor2}, Liu, Rui, Xu, Ling, Zhang, Yining, Li, Xiaotao, Zhao, Zhenkai, Duan, Qiqiang, Wang, Shaogang, Li, Shujun, Ma, Yingjie, Shao, Xiaohong, Yang, Rui^{Aff1, Aff2, Aff4}, Eckert, Jürgen^{Aff5, Aff6}, Ritchie, Robert O.^{Aff7, IDs41586024070481_cor15}, Zhang, Zhefeng^{Aff1, Aff2, IDs41586024070481_cor16}

المصدر: Nature: International weekly journal of science. 626(8001):999-1004

المؤلفون: Guo, Yu^{Aff1, Aff2}, Xie, Xi, Liu, Zengqian^{Aff1, Aff2, IDs1227402360151_cor3}, Zhuo, Longchao^{Aff3, IDs1227402360151_cor4}, Zhang, Jian^{Aff1, Aff4, Aff5}, Wang, Shaogang, Duan, Qiqiang, Jia, Qing^{Aff1, Aff2}, Xu, Dake^{Aff4, Aff5}, Xue, Weihai, Duan, Deli, Berto, Filippo, Zhang, Zhefeng^{Aff1, Aff2, IDs1227402360151_cor13}, Yang, Rui^{Aff1, Aff2}

المصدر: Nano Research. 17(2):806-819

المؤلفون: Yuan, Wucheng, Liu, Ke, Wang, Shaogang, Tan, Chunjian, Ye, Huaiyu

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)