يعرض 1 - 10 نتائج من 123 نتيجة بحث عن '"Wang, Shengcheng"', وقت الاستعلام: 1.04s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Cracking Patterns and Damage Evolution Characteristics of Coal with Bedding Structures Under Liquid Nitrogen Cooling

    المؤلفون: Du, Menglin, Gao, Feng, Zheng, Wenqi, Su, Shanjie, Li, Peng, Sang, ShengAff6, Aff7, Gao, Xianghe, Hou, PengAff8, IDs11053024103433_cor8, Wang, Shengcheng

    المصدر: Natural Resources Research: Official Journal of the International Association for Mathematical Geosciences. :1-22

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  2. 2
    دورية أكاديمية
    Influence of Liquid Nitrogen Freeze–Thaw Cycles on Mechanical Behaviors and Permeability Properties of Coal Under Different Confining Pressures

    المؤلفون: Hou, Peng, Su, ShanjieAff2, IDs00603023037135_cor2, Gao, Feng, Liang, Xin, Wang, Shengcheng, Gao, Yanan, Cai, Chengzheng

    المصدر: Rock Mechanics and Rock Engineering. 57(4):2625-2644

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  3. 3
    دورية أكاديمية
    Strength Characteristics and Instability Mechanism of Combination of Intact Coal and Tectonic Coal Containing Gas Considering the Dip Angle of Interface

    المؤلفون: Lu, ShouqingAff1, Aff3, Bei, TaibiaoAff1, Aff3, Ma, YankunAff2, Aff6, IDs00603023035984_cor3, Wang, Hui, Sa, ZhanyouAff1, Aff3, Liu, JieAff1, Aff3, Li, MingjieAff1, Aff3, Shi, JiangAff1, Aff3, Wang, Shengcheng

    المصدر: Rock Mechanics and Rock Engineering. 57(2):1395-1415

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  4. 4
    دورية أكاديمية
    The influence of mining stress paths on rock damage and permeability

    المؤلفون: Guo, JinshuaiAff1, Aff2, IDs12665024116396_cor1, Ma, LiqiangAff2, Aff3, Liu, ZhigangAff4, IDs12665024116396_cor3, Wang, Shengcheng

    المصدر: Environmental Earth Sciences. 83(10)

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  5. 5
    مؤتمر
    COMB-MCM: Computing-on-Memory-Boundary NN Processor with Bipolar Bitwise Sparsity Optimization for Scalable Multi-Chiplet-Module Edge Machine Learning

    المؤلفون: Zhu, Haozhe, Jiao, Bo, Zhang, Jinshan, Jia, Xinru, Wang, Yunzhengmao, Guan, Tianchan, Wang, Shengcheng, Niu, Dimin, Zheng, Hongzhong, Chen, Chixiao, Wang, Mingyu, Zhang, Lihua, Zeng, Xiaoyang, Liu, Qi, Xie, Yuan, Liu, Ming

    المصدر: 2022 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2022 IEEE International. 65:1-3 Feb, 2022

    Relation: 2022 IEEE International Solid-State Circuits Conference (ISSCC)

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  6. 6
    مؤتمر
    Automated Design Flow for Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging

    المؤلفون: Wang, Shengcheng, Rahul, Dutta, Xie, Danpeng, Guan, Lim Teck, Che, Faxing, Han, Yong, Bhattacharya, Surya

    المصدر: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :448-451 Dec, 2019

    Relation: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

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  7. 7
    مؤتمر
    Leveraging recovery effect to reduce electromigration degradation in power/ground TSV

    المؤلفون: Wang, Shengcheng, Sun, Zeyu, Cheng, Yuan, Tan, Sheldon X.-D., Tahoori, Mehdi B.

    المصدر: 2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) Computer-Aided Design (ICCAD), 2017 IEEE/ACM International Conference on. :811-818 Nov, 2017

    Relation: 2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

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  8. 8
    دورية أكاديمية
    A review of coal permeability models including the internal swelling coefficient of matrix

    المؤلفون: Lu, ShouqingAff1, Aff2, Shi, Jiang, Jiao, Lei, Ma, YankunAff2, IDs40789024007010_cor4, Li, WeiAff4, IDs40789024007010_cor5, Sa, Zhanyou, Liu, Jie, Bei, Taibiao, Wang, Shengcheng

    المصدر: International Journal of Coal Science & Technology. 11(1)

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  9. 9
    مؤتمر
    Recovery-aware proactive TSV repair for electromigration in 3D ICs

    المؤلفون: Wang, Shengcheng, Zhao, Hongyang, Tan, Sheldon X.-D., Tahoori, Mehdi B.

    المصدر: Design, Automation & Test in Europe Conference & Exhibition (DATE), 2017. :220-225 Mar, 2017

    Relation: 2017 Design, Automation & Test in Europe Conference & Exhibition (DATE)

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  10. 10
    مؤتمر
    Multicast Test Architecture and Test Scheduling for Interposer-Based 2.5D ICs

    المؤلفون: Wang, Shengcheng, Wang, Ran, Chakrabarty, Krishnendu, Tahoori, Mehdi B.

    المصدر: 2016 IEEE 25th Asian Test Symposium (ATS) Asian Test Symposium, 2016 IEEE 25th Asian Test Symposium (ATS), 2016 IEEE 25th. :86-91 Nov, 2016

    Relation: 2016 IEEE 25th Asian Test Symposium (ATS)

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