يعرض 1 - 10 نتائج من 171,890 نتيجة بحث عن '"Wang, Wei"', وقت الاستعلام: 1.80s تنقيح النتائج
  1. 1
    مؤتمر
    Indoor Mobile Robot Map Construction Based on Improved Cartographer Algorithm

    المؤلفون: Zheng, Zhong, Xie, Mujun, Jiang, Changhong, Bian, Heyu, Wang, Wei

    المصدر: 2024 WRC Symposium on Advanced Robotics and Automation (WRC SARA) Advanced Robotics and Automation (WRC SARA), 2024 WRC Symposium on. :470-475 Aug, 2024

    Relation: 2024 WRC Symposium on Advanced Robotics and Automation (WRC SARA)

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  2. 2
    مؤتمر
    Partial Discharge Fault Detection of Oil-Paper Insulated Equipment Based on Optical Fiber Direct-Coupled F-P Sensing

    المؤلفون: Liu, Hong, Chen, Weigen, Zhang, Zhixian, Du, Jinchao, Tian, Haoyuan, Song, Xuxuan, Yu, Fan, Sun, Qiuxia, Wang, Wei

    المصدر: 2024 IEEE International Conference on High Voltage Engineering and Applications (ICHVE) High Voltage Engineering and Applications (ICHVE), 2024 IEEE International Conference on. :1-5 Aug, 2024

    Relation: 2024 IEEE International Conference on High Voltage Engineering and Applications (ICHVE)

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  3. 3
    مؤتمر
    Algorithm for Three-Dimensional Detection of Pedestrians in Monocular Roadside View

    المؤلفون: Cui, Hua, Yin, Da, Wang, Wei, Xi, Liugang, Xu, Yue

    المصدر: 2024 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE International Conference on Robotics, Automation and Mechatronics (RAM) Cybernetics and Intelligent Systems (CIS) and IEEE International Conference on Robotics, Automation and Mechatronics (RAM), 2024 IEEE International Conference on. :334-339 Aug, 2024

    Relation: 2024 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE International Conference on Robotics, Automation and Mechatronics (RAM)

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  4. 4
    مؤتمر
    3D Vehicle Detection From Roadside Monocular View Based on Improved CenterNet

    المؤلفون: Wang, Wei, Xi, Liugang, Cui, Hua, Yin, Da, Jingbo, Lan

    المصدر: 2024 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE International Conference on Robotics, Automation and Mechatronics (RAM) Cybernetics and Intelligent Systems (CIS) and IEEE International Conference on Robotics, Automation and Mechatronics (RAM), 2024 IEEE International Conference on. :346-351 Aug, 2024

    Relation: 2024 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE International Conference on Robotics, Automation and Mechatronics (RAM)

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  5. 5
    مؤتمر
    Deep Residual Learning for Channel Estimation in UAV mmWave Systems: A Model-Driven Approach

    المؤلفون: Xie, Daixin, Liu, Chenxi, Wang, Wei, Hu, Xiaoling, Peng, Mugen

    المصدر: 2024 IEEE/CIC International Conference on Communications in China (ICCC) Communications in China (ICCC), 2024 IEEE/CIC International Conference on. :1009-1014 Aug, 2024

    Relation: 2024 IEEE/CIC International Conference on Communications in China (ICCC)

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  6. 6
    مؤتمر
    Open Set Recognition of Communication Jamming Patterns with Raw I/Q Data

    المؤلفون: Du, Ziming, Li, Jiahao, Zhou, Bo, Wang, Wei, Wu, Qihui

    المصدر: 2024 IEEE/CIC International Conference on Communications in China (ICCC) Communications in China (ICCC), 2024 IEEE/CIC International Conference on. :1549-1554 Aug, 2024

    Relation: 2024 IEEE/CIC International Conference on Communications in China (ICCC)

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  7. 7
    مؤتمر
    Frequency-Hopping Signal Recognition of Multiple UAVs with Template Matching

    المؤلفون: Wang, Jiaqi, Wang, Wei, Zhou, Bo, She, Dingchen

    المصدر: 2024 IEEE/CIC International Conference on Communications in China (ICCC) Communications in China (ICCC), 2024 IEEE/CIC International Conference on. :1698-1702 Aug, 2024

    Relation: 2024 IEEE/CIC International Conference on Communications in China (ICCC)

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  8. 8
    مؤتمر
    Research on Efficient Charging and Highly Reliable Non-Contact Welding Sealing Technology for Ultra-Thin Silicon-Based Vapor Chambers

    المؤلفون: Wu, Hongxu, Du, Jianyu, Lyu, Peijue, Shi, Shangyang, Hu, Ran, Kang, Jiajie, Wang, Wei, Zhang, Chi

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  9. 9
    مؤتمر
    High-density embedded silicon fan-out (H-eSiFO) process for a CMOS operational amplifier

    المؤلفون: Chen, Lang, Zhang, Bohan, Zhang, Chi, Wang, Wei

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  10. 10
    مؤتمر
    A Miniaturized Integrated System for Embedded Microchannel Cooling with Manifolds

    المؤلفون: Lyu, Peijue, Cao, Huiquan, Hu, Ran, Jin, Yufeng, Zhang, Chi, Wang, Wei

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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