المؤلفون: GAO Yixuan, WANG Xiyou, CHEN Qianji, YANG Xiaoming, GUO Junming, ZI Yilu, WENG Zhiwen, MA Jingyi, ZHANG Naiwen, LIU Eryang, SHAO Hui, SUN Yanan, YU Changhe

المصدر: Zhongguo quanke yixue, Vol 27, Iss 29, Pp 3672-3678 (2024)

مصطلحات موضوعية: low back pain, roland-morris disability questionnaire, cosmin, validity, reliability, responsiveness, Medicine

وصف الملف: electronic resource

Relation: https://www.chinagp.net/fileup/1007-9572/PDF/20230519.pdf; https://doaj.org/toc/1007-9572

URL الوصول: https://doaj.org/article/405a825c02724e04b55b1f14f6c30fa5

المؤلفون: Lu, Guangsheng, Yang, Daoguo, Li, Wangyun, Wang, Xiyou, Wei, Xiangli, Ai, Binjie

المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-4 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Cao, Sicheng, Yang, Daoguo, Li, Wangyun, Wang, Xiyou, Xue, Shirui, Yun, Zhanfei

المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-4 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Wei, Xiangli, Yang, Daoguo, Li, Wangyun, Wang, Xiyou, Lu, Guangsheng, Xue, Shirui

المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-4 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Duan, Yi, Wang, Xiyou, Yang, Daoguo, Wang, Jing, Ye, Weibin, Wu, Yanchen

المصدر: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020

Relation: 2020 21st International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Wu, Yanchen, Liu, Dongjing, Yang, Daoguo, Wang, Xiyou, Wang, Haojie, Fan, Yasong

المصدر: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020

Relation: 2020 21st International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Wang, Xiyou, Yang, Daoguo, Fan, Yasong, Li, Wangyun

المصدر: 2019 20th International Conference on Electronic Packaging Technology(ICEPT) Electronic Packaging Technology(ICEPT), 2019 20th International Conference on. :1-4 Aug, 2019

Relation: 2019 20th International Conference on Electronic Packaging Technology(ICEPT)

المؤلفون: Fan, Yasong, Liu, Dongjing, Wang, Xiyou, Wang, Haojie, Wu, Yanchen, Yang, D.G.

المصدر: 2019 20th International Conference on Electronic Packaging Technology(ICEPT) Electronic Packaging Technology(ICEPT), 2019 20th International Conference on. :1-5 Aug, 2019

Relation: 2019 20th International Conference on Electronic Packaging Technology(ICEPT)

المؤلفون: Cui, Peng, Cai, Miao, Yang, Daoguo, Wang, Xiyou, Geng, Daoshuang, Liang, Zhi

المصدر: 2019 20th International Conference on Electronic Packaging Technology(ICEPT) Electronic Packaging Technology(ICEPT), 2019 20th International Conference on. :1-4 Aug, 2019

Relation: 2019 20th International Conference on Electronic Packaging Technology(ICEPT)

المؤلفون: Wang, Xiyou, Wang, Lei, Yang, Daoguo, Yang, Zhangping

المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :1312-1316 Aug, 2018

Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)