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1مؤتمر
المؤلفون: Jiang, Hao, Zheng, Jiapei, Wang, Yunzhengmao, Zhang, Jinshan, Zhu, Haozhe, Lyu, Liangjian, Chen, Yingping, Chen, Chixiao, Liu, Qi
المصدر: 2023 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2023 IEEE International Symposium on. :1-5 May, 2023
Relation: 2023 IEEE International Symposium on Circuits and Systems (ISCAS)
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2مؤتمر
المؤلفون: Liu, Shiwei, Li, Peizhe, Zhang, Jinshan, Wang, Yunzhengmao, Zhu, Haozhe, Jiang, Wenning, Tang, Shan, Chen, Chixiao, Liu, Qi, Liu, Ming
المصدر: 2023 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2023 IEEE International. :250-252 Feb, 2023
Relation: 2023 IEEE International Solid-State Circuits Conference (ISSCC)
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3مؤتمر
المؤلفون: Mu, Chen, Wang, Yunzhengmao, Zheng, Jiapei, Liu, Shiwei, Zhou, Keji, Tang, Shan, Chen, Chixiao, Liu, Qi
المصدر: 2022 IEEE 4th International Conference on Artificial Intelligence Circuits and Systems (AICAS) Artificial Intelligence Circuits and Systems (AICAS), 2022 IEEE 4th International Conference on. :222-225 Jun, 2022
Relation: 2022 IEEE 4th International Conference on Artificial Intelligence Circuits and Systems (AICAS)
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4مؤتمر
المؤلفون: Zhu, Haozhe, Jiao, Bo, Zhang, Jinshan, Jia, Xinru, Wang, Yunzhengmao, Guan, Tianchan, Wang, Shengcheng, Niu, Dimin, Zheng, Hongzhong, Chen, Chixiao, Wang, Mingyu, Zhang, Lihua, Zeng, Xiaoyang, Liu, Qi, Xie, Yuan, Liu, Ming
المصدر: 2022 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2022 IEEE International. 65:1-3 Feb, 2022
Relation: 2022 IEEE International Solid-State Circuits Conference (ISSCC)
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5دورية أكاديمية
المؤلفون: Yang, Yinglin, Wang, Yunzhengmao, Yi, Tengyue, Chen, Chixiao, Liu, Qi
المصدر: In Integration May 2024 96
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6دورية أكاديمية
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7دورية
المؤلفون: Liu, Shiwei, Mu, Chen, Jiang, Hao, Wang, Yunzhengmao, Zhang, Jinshan, Lin, Feng, Zhou, Keji, Liu, Qi, Chen, Chixiao
المصدر: IEEE Transactions on Very Large Scale Integration Systems; February 2024, Vol. 32 Issue: 2 p269-282, 14p