المؤلفون: Kalaiarasan, Koteeswaran^{Aff1, Aff2}, Nakahara, Yuto, Suzuki, Yuhei, Tomita, Motohiro^{Aff3, Aff4}, Salleh, Faiz, Matsuki, Takeo, Matsukawa, Takashi, Watanabe, Takanobu, Inokawa, Hiroshi, Hamasaki, Hiromu, Hayakawa, Yasuhiro, Ikeda, Hiroya^{Aff1, Aff2, IDs42247024007475_cor12}

المصدر: Emergent Materials. :1-8

المؤلفون: Inokawa, Hiroshi, Goi, Yuto, Yorigami, Toshiaki, Shirotori, Kyohei, Satoh, Hiroaki, Tomita, Motohiro, Matsuki, Takeo, Ikeda, Hiroya, Watanabe, Takanobu

المصدر: 2021 17th International Conference on Quality in Research (QIR): International Symposium on Electrical and Computer Engineering Quality in Research (QIR): International Symposium on Electrical and Computer Engineering, 2021 17th International Conference on. :119-122 Oct, 2021

Relation: 2021 17th International Conference on Quality in Research (QIR): International Symposium on Electrical and Computer Engineering

المؤلفون: Watanabe, Takanobu, Nishimori, Kentaro

المصدر: 2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM) Electromagnetics: Applications and Student Innovation Competition (iWEM), 2022 IEEE International Workshop on. :19-20 Aug, 2022

Relation: 2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM)

المؤلفون: Abe, Katsuki, Oda, Kaito, Tomita, Motohiro, Matsuki, Takeo, Matsukawa, Takashi, Watanabe, Takanobu

المصدر: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2020 International Conference o. :75-78 Sep, 2020

Relation: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: Suzuki, Yuhei, Fujita, Yuma, Fauziah, Khotimatul, Nogita, Takuto, Ikeda, Hiroya, Watanabe, Takanobu, Kamakura, Yoshinari

المصدر: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2020 International Conference o. :15-18 Sep, 2020

Relation: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: Kida, Yusuke, Sankawa, Rina, Takahashi, Kohei, Yamamoto, Shuhei, Watanabe, Takanobu, Mura, Kotaro, Ohgashi, Yoshihiro, Yoshimitsu, Tetsuo, Imai, Takahiro

المصدر: 2020 International Symposium on Electrical Insulating Materials (ISEIM) Electrical Insulating Materials (ISEIM), 2020 International Symposium on. :297-300 Sep, 2020

Relation: 2020 International Symposium on Electrical Insulating Materials (ISEIM)

المؤلفون: Watanabe, Takanobu, Nishimori, Kentaro

المصدر: 2021 International Symposium on Antennas and Propagation (ISAP) Antennas and Propagation (ISAP), 2021 International Symposium on. :1-2 Oct, 2021

Relation: 2021 International Symposium on Antennas and Propagation (ISAP)

المؤلفون: Onishi, Takuya, Hashimoto, Shuichiro, Tomita, Motohiro, Watanabe, Takanobu, Mura, Kotaro, Tsuda, Toshihiro, Yoshimitsu, Tetsuo

المصدر: 2017 International Symposium on Electrical Insulating Materials (ISEIM) Electrical Insulating Materials (ISEIM), 2017 International Symposium on. 1:359-362 Sep, 2017

Relation: 2017 International Symposium on Electrical Insulating Materials (ISEIM)

المؤلفون: Kamada, Shin, Ichimura, Takumi, Watanabe, Takanobu

المصدر: 2016 IEEE 9th International Workshop on Computational Intelligence and Applications (IWCIA) Computational Intelligence and Applications (IWCIA), 2016 IEEE 9th International Workshop on. :125-130 Nov, 2016

Relation: 2016 IEEE 9th International Workshop on Computational Intelligence and Applications (IWCIA)

المؤلفون: Hashimoto, Shuichiro, Takahashi, Kouta, Oba, Shunsuke, Terada, Takuya, Ogasawara, Masataka, Tomita, Motohiro, Kurosawa, Masashi, Watanabe, Takanobu

المصدر: 2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) Electron Devices Technology and Manufacturing Conference (EDTM), 2018 IEEE 2nd. :283-285 Mar, 2018

Relation: 2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM)