المؤلفون: Chong, S. C., Wee, D. H. S., Rao, V. S., Vasarla, N. S.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 3(10):1654-1662 Oct, 2013

المؤلفون: Giusti D., Quaglia F., Rahul D., Rao V. S., Savoia A., Shaw M., Wee D. H. S.

المساهمون: Giusti, D., Quaglia, F., Rahul, D., Rao, V.S., Savoia, A., Shaw, M., Wee, D.H.S., Giusti, D., Quaglia, F., Rahul, D., Rao, V. S., Savoia, A., Shaw, M., Wee, D. H. S.

المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d8a8fdec74447d1a449607f314b18144
https://doi.org/10.1109/eptc56328.2022.10013202