المؤلفون: Jou, S. K., Hu, L. C., Yang, C. R., Lin, Y. W., Wang, C. J., Wei, T. C., Lee, C. C., Chang, J. Y., Chen, I. C., Li, Tomi T.

المصدر: 2016 China Semiconductor Technology International Conference (CSTIC) Semiconductor Technology International Conference (CSTIC), 2016 China. :1-3 Mar, 2016

Relation: 2016 China Semiconductor Technology International Conference (CSTIC)

المؤلفون: Hu, L.C., Lin, Y.W., Wang, C.J., Wei, T. C., Yang, C.R., Lee, C.C., Chang, J.Y., Chen, I.C., Li, Tomi T.

المصدر: 2015 China Semiconductor Technology International Conference Semiconductor Technology International Conference (CSTIC), 2015 China. :1-3 Mar, 2015

Relation: 2015 China Semiconductor Technology International Conference (CSTIC)

المؤلفون: Brun, C., Wei, T. C., Franck, P., Chong, Y. C., Congxiang, L., Leong, C. W., Tan, D., Kang, T. B., Coquet, P., Baillargeat, D.

المصدر: IEEE Transactions on Terahertz Science and Technology IEEE Trans. THz Sci. Technol. Terahertz Science and Technology, IEEE Transactions on. 5(3):383-390 May, 2015

المؤلفون: Liu, W.-C., Wei, T.-C., Huang, Y.-S., Chan, C.-D., Jou, S.-J.

المصدر: IEEE Transactions on Circuits and Systems I: Regular Papers IEEE Trans. Circuits Syst. I Circuits and Systems I: Regular Papers, IEEE Transactions on. 62(2):545-553 Feb, 2015

المؤلفون: Liu, W.-C., Yeh, F.-C., Wei, T.-C., Chan, C.-D., Jou, S.-J.

المصدر: IEEE Transactions on Circuits and Systems I: Regular Papers IEEE Trans. Circuits Syst. I Circuits and Systems I: Regular Papers, IEEE Transactions on. 60(10):2730-2739 Oct, 2013

المؤلفون: Juang, F.-R., Fang, Y.-K., Chiang, Y.-T., Wei, T.-C., Lin, B.-W.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 11(12):3446-3450 Dec, 2011

المؤلفون: Chandrappan, J., Kuruveettil, H., Wei, T. C., Liang, C. T. W., Ramana, P. V., Suzuki, K., Shioda, T., Lau, J. H.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 1(3):318-326 Mar, 2011

المؤلفون: Guan, L. T., Mong, K. Y., Yoon, J. C. Y., Liang, C. T. W., Yi, G. H. Y., Jie, Y. G., Ramana, P. V., Wei, T. C., Damaruganath, P.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 1(1):125-132 Jan, 2011

المؤلفون: Chiang, Y.-T., Fang, Y.-K., Chou, T.-H., Juang, F.-R., Hsu, K.-C., Wei, T.-C., Lin, C.-I., Chen, C.-W., Liang, C.-Y.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 10(8):1291-1296 Aug, 2010

المؤلفون: Peters, N.A., Barreiro, J.T., Goggin, M.E., Wei, T.-C., Kwiat, P.G.

المصدر: 2005 Quantum Electronics and Laser Science Conference Quantum Electronics and Laser Science Quantum Electronics and Laser Science Conference, 2005. QELS '05. 1:307-309 Vol. 1 2005

Relation: 2005 Quantum Electronics and Laser Science Conference (QELS)