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1دورية أكاديمية
المؤلفون: Ji-Hao Chen, Chi-Feng Weng, Wei-Chung Wang, Yi-Peng Kao, Jia-Lin Tsai, Yi-Ju Chen, Hui-Ling Lee, Tsung-Ting Shih
المصدر: Journal of the Chinese Chemical Society; May2024, Vol. 71 Issue 5, p474-481, 8p
مصطلحات موضوعية: DIGESTION, SPECTROMETERS, METALS testing, MANUFACTURING processes, ADDITIVES, EGGS
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2دورية أكاديمية
المؤلفون: Che-Yu Hsu, Shih-Min Lin, Ngan Ming Tsang, Yu-Hsiang Juan, Chun-Wei Wang, Wei-Chung Wang, Sung-Hsin Kuo
المصدر: Clinical and Translational Radiation Oncology, Vol 25, Iss , Pp 1-9 (2020)
مصطلحات موضوعية: Hypopharyngeal squamous cell carcinoma, Organ preservation treatment, Radiomics, Loco-regional failure, Survival, Medical physics. Medical radiology. Nuclear medicine, R895-920, Neoplasms. Tumors. Oncology. Including cancer and carcinogens, RC254-282
وصف الملف: electronic resource
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3دورية أكاديمية
المؤلفون: Cheng Juang, Shaw Tzuu Huang, Chin Yueh Liu, Wei Chung Wang, Tsung Min Hwang, Jonq Juang, Wen Wei Lin
المصدر: IEEE Journal of Quantum Electronics IEEE J. Quantum Electron. Quantum Electronics, IEEE Journal of. 39(10):1321-1326 Oct, 2003
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4مؤتمر
المؤلفون: Chiung-Wen Lin, Chia-Pao Hsu, Hsueh-An Yang, Wei Chung Wang, Weileun Fang
المصدر: 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on. :802-805 Jan, 2008
Relation: 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems
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5مؤتمر
المؤلفون: Hsueh-An Yang, Chen-Chao Wang, Po-Jen Zheng, Wei-Chung Wang
المصدر: 2007 International Microsystems, Packaging, Assembly and Circuits Technology Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International. :173-176 Oct, 2007
Relation: 2007 International Microsystems, Packaging, Assembly and Circuits Technology
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6مؤتمر
المؤلفون: Chien-Yu Chen, Cheng-Hui Hung, Jhih-You Jhong, Feng-Yan Wang, Wei-Min Hsaio, Meng-Jen Wang, Wei-Chung Wang
المصدر: 2007 International Microsystems, Packaging, Assembly and Circuits Technology Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International. :177-180 Oct, 2007
Relation: 2007 International Microsystems, Packaging, Assembly and Circuits Technology
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7دورية أكاديمية
المؤلفون: Wei-Chung Wang, Kai-Hong Lai
المصدر: IEEE Transactions on Consumer Electronics IEEE Trans. Consumer Electron. Consumer Electronics, IEEE Transactions on. 45(4):1046-1056 Nov, 1999
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8دورية أكاديمية
المؤلفون: Tsung-Feng Wu, Yu-Chen Chen, Wei-Chung Wang, Yen-Chi Fang, Scott Fukuoka, David T. Pride, On Shun Pak
المصدر: ACS Central Science, Vol 4, Iss 11, Pp 1485-1494 (2018)
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2374-7951
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9دورية أكاديمية
المؤلفون: Wei-Chung Wang, Chi-Wai Chow, Chia-Wei Chen, Hsiang-Chain Hsieh, Yen-Ting Chen
المصدر: IEEE Photonics Journal, Vol 9, Iss 6, Pp 1-6 (2017)
مصطلحات موضوعية: Light emitting diode (LED), visible light communication (VLC), CMOS image sensor., Applied optics. Photonics, TA1501-1820, Optics. Light, QC350-467
وصف الملف: electronic resource
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10
المؤلفون: Xiaonan Li, E. A. Patterson, Wei-Chung Wang, W. J. R. Christian
المصدر: Journal of Nondestructive Evaluation. 42
مصطلحات موضوعية: Mechanics of Materials, Mechanical Engineering