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1مؤتمر
المؤلفون: Wei Keat Loh, Kulterman, Ron, Fu, Haley, Tsuriya, Masahiro
المصدر: 2016 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2016 International Conference on. :89-93 Apr, 2016
Relation: 2016 International Conference on Electronics Packaging (ICEP)
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2مؤتمر
المؤلفون: Wei Keat Loh, Kulterman, Ron, Purdie, Tim, Fu, Haley, Tsuriya, Masahiro
المصدر: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on. :233-238 Apr, 2015
Relation: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
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3مؤتمر
المؤلفون: Keh Shin Beh, Wei Keat Loh, Jenn Seong Leong, Wooi Aun Tan
المصدر: 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on. :1-5 Jun, 2005
Relation: 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis
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4
المؤلفون: Muhammad Afiq Azmi, Mohd Zulkifly Abdullah, Raa Khimi Shuib, Zulkifli Mohamad Ariff, Wei Keat Loh, Renn Chan Ooi, Chun Keang Ooi, Muhammad Khalil Abdullah
المصدر: Polymer Bulletin.
مصطلحات موضوعية: Polymers and Plastics, Materials Chemistry, General Chemistry, Condensed Matter Physics
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5دورية أكاديمية
المؤلفون: Chin, Ian, Wei Keat Loh, Bin Abdullah, Mohd Zulkifly
المصدر: Journal of Microelectronic & Electronic Packaging; 2023 4th Quarter, Vol. 20 Issue 4, p123-129, 7p
مصطلحات موضوعية: DIGITAL image correlation, THERMAL expansion, HEAT resistant materials, SWELLING of materials, HYGROTHERMOELASTICITY
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6مؤتمر
المؤلفون: Chee Kan, Lee, Derek, Rebsom, Wei Keat, Loh, Hui Ping, Ng, Kam Wah, Lau
المصدر: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International. :1-1 Nov, 2008
Relation: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)
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7مؤتمر
المؤلفون: Malatkar, P., Shaw Fong Wong, Pringle, T., Wei Keat Loh
المصدر: 56th Electronic Components and Technology Conference 2006 Electronic Components & Technology Electronic Components and Technology Conference, 2006. Proceedings. 56th. :6 pp. 2006
Relation: 2006 Proceedings. 56th Electronic Components & Technology Conference
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8
المؤلفون: Charles Arvin, Sze Pei Lim, David Locker, Wei Keat Loh, Keith Sweatman, Francis Lee, Masahiro Tsuriya
المصدر: 2022 International Conference on Electronics Packaging (ICEP).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::eadb16e9349ce8ae907b554fcf576f79
https://doi.org/10.23919/icep55381.2022.9795576 -
9
المؤلفون: Ian Chin, Wei Keat Loh, Mohd Zulkifly Bin Abdullah
المصدر: 2022 International Conference on Electronics Packaging (ICEP).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b63594159c78f98e73d3f1a74690ac87
https://doi.org/10.23919/icep55381.2022.9795598 -
10
المؤلفون: Charles L. Arvin, Keith Sweatman, Wei Keat Loh, Derek Daily, David Locker, Naoki Kubota, Masahiro Tsuriya, Sze Pei Lim, Ravi Pokhrel
المصدر: 2021 International Conference on Electronics Packaging (ICEP).
مصطلحات موضوعية: Interconnection, Materials science, chemistry, Whisker, Intermetallic, chemistry.chemical_element, Fusible alloy, Tin, Engineering physics, Electromigration, Capacitance, Indium
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a756d6f8414b19ffd3d468cb8830caef
https://doi.org/10.23919/icep51988.2021.9451941
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