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المؤلفون: Jay Li, Wei Jhen Chen, Joe Lin, Mu Hsuan Chan, Tank Lo, Bruce Xu, Liang Yih Hung, Nicholas Kao, Don Son Jiang, Yu-Po Wang
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f3a565fe30a41e9ff96846c298c3e6fc
https://doi.org/10.1109/ectc51906.2022.00181 -
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المؤلفون: Mu Hsuan Chan, Don Son Jiang, Wei Jhen Chen, C. M. Huang, Chris Chuang, C. Key Chung, Yu Lung Huang
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Reflow soldering, Materials science, business.product_category, business.industry, Soldering, Optoelectronics, Die (manufacturing), Wafer, Coplanarity, Thermocompression bonding, business, Chip, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6c8f39e5c752e00c79844fb8fdb635f6
https://doi.org/10.1109/ectc32696.2021.00087 -
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المؤلفون: Wei-Jhen Chen, Chih-Hui Hsu, Tzu-Ching Chen, Ming-Tzer Lin, Ti-Yuan Wu, Yue-Lin Lee
المصدر: Journal of Electronic Materials. 47:35-48
مصطلحات موضوعية: 010302 applied physics, Materials science, Metallurgy, Intermetallic, 02 engineering and technology, 021001 nanoscience & nanotechnology, Condensed Matter Physics, 01 natural sciences, Electromigration, Electronic, Optical and Magnetic Materials, Stress (mechanics), Grain growth, Electrical resistivity and conductivity, 0103 physical sciences, Materials Chemistry, Grain boundary diffusion coefficient, Electrical and Electronic Engineering, Electric current, 0210 nano-technology, Flip chip