يعرض 1 - 10 نتائج من 36 نتيجة بحث عن '"Weihai Bu"', وقت الاستعلام: 0.88s تنقيح النتائج
  1. 1
    مؤتمر
    Novel Localized-SOI MOSFET's Combining the Advantages of SOI and Bulk Substrates for Highly-Scaled Devices

    المؤلفون: Ru Huang, Yu Tian, Han Xiao, Weihai Bu, Chuguang Feng, Mansun Chan, Xing Zhang, Yangyuan Wang

    المصدر: 2005 IEEE Conference on Electron Devices and Solid-State Circuits Electron Devices and Solid-State Circuits, 2005 IEEE Conference on. :81-86 2005

    Relation: 2005 IEEE Conference on Electron Devices and Solid-State Circuits

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  2. 2
    مؤتمر
    A novel technique of silicon-on-nothing MOSFETs fabrication by hydrogen and helium co-implantation

    المؤلفون: Weihai Bu, Ru Huang, Ming Li, Yu Tian, Yangyuan Wang

    المصدر: Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004. Solid-state and integrated circuits technology Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on. 1:269-272 vol.1 2004

    Relation: 2004 7th International Conference on Solid-State and Integrated Circuits Technology Proceedings

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  3. 3
    Transient-Liquid-Phase Bonding of Granulated Cu–Sn Bumps With a 4-μm Fine Pitch

    المؤلفون: Yunfan Shi, Zilin Wang, Huawei Zhang, Jin Kang, Kai Zheng, Weihai Bu, Zheyao Wang

    المصدر: IEEE Transactions on Electron Devices. 70:683-688

    مصطلحات موضوعية: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e432f6106de66c472378fe3de9ccd288
    https://doi.org/10.1109/ted.2022.3227895

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  4. 4
    مؤتمر
    DTMOS mode as an effective solution of RTN suppression for robust device/circuit co-design

    المؤلفون: Shaofeng Guo, Huang, Ru, Peng Hao, Mulong Luo, Pengpeng Ren, Jianping Wang, Weihai Bu, Jingang Wu, Waisum Wong, Scott Yu, Hanming Wu, Shiuh-Wuu Lee, Wang, Runsheng, Yangyuan Wang

    المصدر: 2014 IEEE International Electron Devices Meeting Electron Devices Meeting (IEDM), 2014 IEEE International. :12.6.1-12.6.4 Dec, 2014

    Relation: 2014 IEEE International Electron Devices Meeting (IEDM)

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  5. 5
    مؤتمر
    New insights into the design for end-of-life variability of NBTI in scaled high-κ/metal-gate Technology for the nano-reliability era

    المؤلفون: Pengpeng Ren, Wang, Runsheng, Ji, Zhigang, Peng Hao, Xiaobo Jiang, Shaofeng Guo, Mulong Luo, Duan, Meng, Zhang, Jian F., Jianping Wang, Jinhua Liu, Weihai Bu, Jingang Wu, Waisum Wong, Shaofeng Yu, Hanming Wu, Shiuh-Wuu Lee, Nuo Xu, Ru Huang

    المصدر: 2014 IEEE International Electron Devices Meeting Electron Devices Meeting (IEDM), 2014 IEEE International. :34.1.1-34.1.4 Dec, 2014

    Relation: 2014 IEEE International Electron Devices Meeting (IEDM)

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  6. 6
    Layout Optimization of Complementary FET 6T-SRAM Cell Based on a Universal Methodology Using Sensitivity With Respect to Parasitic - and -Values

    المؤلفون: Yanna Luo, Lei Cao, Qingzhu Zhang, Yu Cao, Zhaohao Zhang, Jiaxin Yao, Gangping Yan, Xuexiang Zhang, Weizhuo Gan, Jiali Huo, Haoqing Xu, Guoliang Tian, Weihai Bu, Yongqin Wu, Zhenhua Wu, Huaxiang Yin

    المصدر: IEEE Transactions on Electron Devices. 69:6095-6101

    مصطلحات موضوعية: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f5547fac9aa0a002d984c2c1bdfd7213
    https://doi.org/10.1109/ted.2022.3207972

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  7. 7
    Novel Channel-First Fishbone FETs With Symmetrical Threshold Voltages and Balanced Driving Currents Using Single Work Function Metal Process

    المؤلفون: Lei Cao, Qingzhu Zhang, Yanna Luo, Jie Gu, Weizhuo Gan, Peng Lu, Jiaxin Yao, Haoqing Xu, Peng Zhao, Kun Luo, Yongqin Wu, Weihai Bu, Zhenhua Wu, Huaxiang Yin

    المصدر: IEEE Transactions on Electron Devices. 69:5971-5977

    مصطلحات موضوعية: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::80a06eaa22c9e27ef164b8d04c3ce798
    https://doi.org/10.1109/ted.2022.3206179

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  8. 8
    Bonding of 5 μm Cu-Sn Micro Bumps Using Thermal Reflow and Solid-State Pre-Bonding

    المؤلفون: Yunfan Shi, Zilin Wang, Jin Kang, Kai Zheng, Weihai Bu, Zheyao Wang

    المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:1609-1617

    مصطلحات موضوعية: Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Electronic, Optical and Magnetic Materials

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::31af2331f6296e42bb2561b3b3eae3a6
    https://doi.org/10.1109/tcpmt.2022.3213540

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  9. 9
    Experimental Investigation of Ultrathin Al₂O₃ Ex-Situ Interfacial Doping Strategy on Laminated HKMG Stacks via ALD

    المؤلفون: Renren Xu, Jiaxin Yao, Gaobo Xu, Yanzhao Wei, Huaxiang Yin, Qingzhu Zhang, Guoliang Tian, Yanrong Wang, Gangping Yan, Jinjuan Xiang, Weihai Bu, Yongqin Wu, Zhenhua Wu, Jun Luo, Wenwu Wang

    المصدر: IEEE Transactions on Electron Devices. 69:1964-1971

    مصطلحات موضوعية: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::542615b7121354aedfb50fe0b3de78ec
    https://doi.org/10.1109/ted.2022.3152976

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  10. 10
    The Effect of Γ-Ray Irradiation on Voltage-Controlled Magnetism of Hfzro/Cofeb Hall Bar Device

    المؤلفون: Wei Cao, Jia Chen, Peiyue Yu, Lei Zhao, Yanru Li, Meiyin Yang, Jing Xu, Jianfeng Gao, Jin Kang, Weihai Bu, kai zheng, Bingjun Yang, Lei Yue, Zuo Chao, Yan Cui, jun luo

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8c2968968cc721331eb1dd359b3e82ca
    https://doi.org/10.2139/ssrn.4340789

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