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1
المؤلفون: Hong Cai, Md Hazwani Khairy, Rachel Ang, Linfang Xu, Doris Ng, Nanxi Li, Zhonghua Gu, Anmin Kong, Weiguo Chen, Wen Wei Seit, Eva Wai Leong Ching, Norhanani Jaafar, Huanhuan Wang, Landobasa Y.M. Tobing, Leh Woon Lim, Qingxin Zhang, Lennon Yao Ting Lee
المصدر: Silicon Photonics XVIII.
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ebb2974ab4d231b9eb320b8068bc87e1
https://doi.org/10.1117/12.2650363 -
2
المؤلفون: Sharon Pei Siang Lim, Ser Choong Chong, Wen Wei Seit, Jacob Jordan Soh, Sasi Kumar Tippabhotla, Vempati Srinivasa Rao
المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d4a4d244b84b057492394d58230966e6
https://doi.org/10.1109/eptc56328.2022.10013169 -
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المؤلفون: Wen Wei Seit, Ser Choong Chong, Sharon Lim, B G Sajay
المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bd337ae72ee0b016ca896cfe62ef2ffa
https://doi.org/10.1109/eptc56328.2022.10013110 -
4
المؤلفون: Peng Zhao, Hong Yu Li, Yu Dian Lim, Wen Wei Seit, Luca Guidoni, Chuan Seng Tan
المساهمون: School of Electrical and Electronic Engineering, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
مصطلحات موضوعية: Grounding Plane, Heterogenous Integration, Electrical and electronic engineering::Electronic packaging [Engineering]
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::282c41b0a3645547d9b878c05cc7fedc
https://hdl.handle.net/10356/166181 -
5
المؤلفون: Sharon Pei Siang Lim, Ser Choong Chong, David Ho Soon Wee, Wen Wei Seit, Jacob Jordan Soh, Tai Chong Chai
المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f335c12ca48525d43c91fba0d60465b3
https://doi.org/10.1109/eptc53413.2021.9663972 -
6
المؤلفون: Peng Zhao, Xin Wen Bi, Hong Yu Li, Yu Dian Lim, Wen Wei Seit, Luca Guidoni, Chuan Seng Tan
المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c76c627ff2e270fccc9391e9fea3fd45
https://doi.org/10.1109/eptc53413.2021.9663904 -
7
المؤلفون: Wen Wei Seit, Ser Choong Chong, Cai Hong, Eva Wai, Rachel Ang
المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7449e1c630a6085e984b372a8744ec68
https://doi.org/10.1109/eptc53413.2021.9663979 -
8Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio
المؤلفون: Ser Choong Chong, Simon Siak Boon Lim, Tai Chong Chai, Wen Wei Seit, Debbie Claire Sanchez
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Materials science, Fabrication, engineering.material, medicine.disease_cause, Die (integrated circuit), Coating, Etching (microfabrication), Plating, Mold, engineering, medicine, Wafer, Composite material, Lithography
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8d903e6a5baaf232b070b1770b8d2c34
https://doi.org/10.1109/ectc32696.2021.00177 -
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المؤلفون: Jing Tao, Yu Dian Lim, Chuan Seng Tan, Luca Guidoni, Peng Zhao, Wen Wei Seit, Hongyu Li
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Condensed Matter::Quantum Gases, Wire bonding, Materials science, Silicon, business.industry, chemistry.chemical_element, Trap (computing), chemistry, Interposer, Optoelectronics, Insertion loss, Wafer, Redistribution layer, Physics::Atomic Physics, Ion trap, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bfa39d9d38e0894a4ee115f5698a5d76
https://doi.org/10.1109/ectc32696.2021.00054 -
10
المؤلفون: Yu Dian Lim, Chuan Seng Tan, Luca Guidoni, Jing Tao, Peng Zhao, Wen Wei Seit, Jean-Pierre Likforman, T. Henner, Hongyu Li
المساهمون: Laboratoire Matériaux et Phénomènes Quantiques (MPQ (UMR_7162)), Centre National de la Recherche Scientifique (CNRS)-Université de Paris (UP), School of Electrical and Electronic Engineering
المصدر: Applied Physics Letters
Applied Physics Letters, American Institute of Physics, 2021, 118 (12), pp.124003. ⟨10.1063/5.0042531⟩مصطلحات موضوعية: Materials science, Fabrication, Physics and Astronomy (miscellaneous), Atomic Physics (physics.atom-ph), Electrical and electronic engineering::Semiconductors [Engineering], FOS: Physical sciences, 02 engineering and technology, 01 natural sciences, Ion, Physics - Atomic Physics, Trap (computing), [PHYS.QPHY]Physics [physics]/Quantum Physics [quant-ph], Parasitic capacitance, Physics [Science], 0103 physical sciences, Wafer, [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, ComputingMilieux_MISCELLANEOUS, 010302 applied physics, Quantum Physics, [PHYS.PHYS.PHYS-ATOM-PH]Physics [physics]/Physics [physics]/Atomic Physics [physics.atom-ph], business.industry, TSV, Dissipation, 021001 nanoscience & nanotechnology, Interposer, Optoelectronics, Qubit, Ion trap, Quantum Physics (quant-ph), 0210 nano-technology, business
وصف الملف: application/pdf
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