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1دورية أكاديمية
المؤلفون: Ming-Hsiao Lee, Wen-Hwa Chen, Ying Mao
المصدر: Micromachines, Vol 12, Iss 6, p 674 (2021)
مصطلحات موضوعية: meshless method, additive manufacturing, 3D printing, layer-by-layer, layer-based, Mechanical engineering and machinery, TJ1-1570
وصف الملف: electronic resource
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2دورية أكاديمية
المؤلفون: Hsien-Chie Cheng, Wei-Heng Xu, Wen-Hwa Chen, Pi-Hsien Wang, Kuo-Feng Chen, Chih-Chia Chang
المصدر: Advances in Materials Science and Engineering, Vol 2015 (2015)
مصطلحات موضوعية: Materials of engineering and construction. Mechanics of materials, TA401-492
وصف الملف: electronic resource
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3مؤتمر
المؤلفون: Ruei-You Hong, Hsien-Chie Cheng, Hsuan-Chi Hu, Wen-Hwa Chen
المصدر: 2016 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2016 International Conference on. :282-285 Apr, 2016
Relation: 2016 International Conference on Electronics Packaging (ICEP)
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4مؤتمر
المؤلفون: Wen-Hwa Chen, Hsien-Chie Cheng, Ching-Feng Yu
المصدر: 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on. :1-7 Apr, 2010
Relation: 2010 11th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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5مؤتمر
المؤلفون: Hsien-Chie Cheng, Ching-Feng Yu, Wen-Hwa Chen
المصدر: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International. :240-242 Oct, 2012
Relation: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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6دورية أكاديمية
المؤلفون: Hsien-Chie Cheng, Wen-Hwa Chen, I-Chun Chung
المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 27(2):359-372 Jun, 2004
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7دورية أكاديمية
المؤلفون: Wen-Hwa Chen, Hsien-Chie Cheng, Hsin-An Shen
المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 26(1):222-232 Mar, 2003
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8مؤتمر
المؤلفون: Su-Tsai Lu, Wen-Hwa Chen
المصدر: 2008 58th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2008. ECTC 2008. 58th. :1287-1293 May, 2008
Relation: 2008 58th Electronic Components and Technology Conference (ECTC 2008)
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9مؤتمر
المؤلفون: Hsien-Chie Cheng, Chieh-Sheng Lin, Wen-Hwa Chen, Yung-Yue Hsu, Ruoh-Huey Uang
المصدر: 2006 International Microsystems, Package, Assembly Conference Taiwan Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International. :1-4 Oct, 2006
Relation: 2006 International Microsystems, Package, Assembly Conference Taiwan
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10
المؤلفون: Hsien-Chie Cheng, Chia-Heng Chung, Wen-Hwa Chen
المصدر: IEEE Transactions on Device and Materials Reliability. 20:136-145
مصطلحات موضوعية: Viscosity, Materials science, Compression molding, Wafer, Adhesive, Molding (process), Electrical and Electronic Engineering, Composite material, Safety, Risk, Reliability and Quality, Material properties, Wafer-level packaging, Die (integrated circuit), Electronic, Optical and Magnetic Materials