المؤلفون: Ming-Hsiao Lee, Wen-Hwa Chen, Ying Mao

المصدر: Micromachines, Vol 12, Iss 6, p 674 (2021)

مصطلحات موضوعية: meshless method, additive manufacturing, 3D printing, layer-by-layer, layer-based, Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2072-666X/12/6/674; https://doaj.org/toc/2072-666X

URL الوصول: https://doaj.org/article/918f711220344aa4b0ce34cfdcd13d35

المؤلفون: Hsien-Chie Cheng, Wei-Heng Xu, Wen-Hwa Chen, Pi-Hsien Wang, Kuo-Feng Chen, Chih-Chia Chang

المصدر: Advances in Materials Science and Engineering, Vol 2015 (2015)

مصطلحات موضوعية: Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: https://doaj.org/toc/1687-8434; https://doaj.org/toc/1687-8442

URL الوصول: https://doaj.org/article/3991f761ffc54ba79dff5f8478890cd7

المؤلفون: Ruei-You Hong, Hsien-Chie Cheng, Hsuan-Chi Hu, Wen-Hwa Chen

المصدر: 2016 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2016 International Conference on. :282-285 Apr, 2016

Relation: 2016 International Conference on Electronics Packaging (ICEP)

المؤلفون: Wen-Hwa Chen, Hsien-Chie Cheng, Ching-Feng Yu

المصدر: 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on. :1-7 Apr, 2010

Relation: 2010 11th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Hsien-Chie Cheng, Ching-Feng Yu, Wen-Hwa Chen

المصدر: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International. :240-242 Oct, 2012

Relation: 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Hsien-Chie Cheng, Wen-Hwa Chen, I-Chun Chung

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 27(2):359-372 Jun, 2004

المؤلفون: Wen-Hwa Chen, Hsien-Chie Cheng, Hsin-An Shen

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 26(1):222-232 Mar, 2003

المؤلفون: Su-Tsai Lu, Wen-Hwa Chen

المصدر: 2008 58th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2008. ECTC 2008. 58th. :1287-1293 May, 2008

Relation: 2008 58th Electronic Components and Technology Conference (ECTC 2008)

المؤلفون: Hsien-Chie Cheng, Chieh-Sheng Lin, Wen-Hwa Chen, Yung-Yue Hsu, Ruoh-Huey Uang

المصدر: 2006 International Microsystems, Package, Assembly Conference Taiwan Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International. :1-4 Oct, 2006

Relation: 2006 International Microsystems, Package, Assembly Conference Taiwan

المؤلفون: Hsien-Chie Cheng, Chia-Heng Chung, Wen-Hwa Chen

المصدر: IEEE Transactions on Device and Materials Reliability. 20:136-145

مصطلحات موضوعية: Viscosity, Materials science, Compression molding, Wafer, Adhesive, Molding (process), Electrical and Electronic Engineering, Composite material, Safety, Risk, Reliability and Quality, Material properties, Wafer-level packaging, Die (integrated circuit), Electronic, Optical and Magnetic Materials

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4c226ab9e95b27769c63cbdffae16b8d
https://doi.org/10.1109/tdmr.2020.2965000