المؤلفون: Guo, D., Shang, H., Seo, K., Haran, B., Standaert, T., Gupta, D., Alptekin, E., Bae, D., Bae, G., Chanemougame, D., Cheng, K., Cho, J., Hamieh, B., Hong, J., Hook, T., Jung, J., Kambhampati, R., Kim, B., Kim, H., Kim, K., Kim, T., Liu, D., Mallela, H., Montanini, P., Mottura, M., Nam, S., Ok, I., Park, Y., Paul, A., Prindle, C., Ramachandran, R., Sardesai, V., Scholze, A., Seo, S., Southwick, R., Strane, J., Sun, X., Tsutsui, G., Tripathi, N., Vega, R., Weybright, M., Xie, R., Yeh, C., Bu, H., Burns, S., Canaperi, D., Celik, M., Colburn, M., Jagannathan, H., Kanakasabaphthy, S., Kleemeier, W., Liebmann, L., Mcherron, D., Oldiges, P., Paruchuri, V., Spooner, T., Stathis, J., Divakaruni, R., Gow, T., Iacoponi, J., Jenq, J., Sampson, R, Yang, W., Khare, M.

المصدر: 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on. :1-4 Oct, 2014

Relation: 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT)

المؤلفون: Rideau, D., Quenette, V., Garetto, D., Dornel, E., Weybright, M., Manceau, J. P, Saxod, O., Tavernier, C., Jaouen, H.

المصدر: 2010 International Conference on Microelectronic Test Structures (ICMTS) Microelectronic Test Structures (ICMTS), 2010 IEEE International Conference on. :210-213 Mar, 2010

Relation: 2010 International Conference on Microelectronic Test Structures (ICMTS)

المؤلفون: Luo, Z., Steegen, A., Eller, M., Mann, R., Baiocco, C., Nguyen, P., Kim, L., Hoinkis, M., Ku, V., Klee, V., Jamin, F., Wrschka, P., Shafer, P., Lin, W., Fang, S., Ajmera, A., Tan, W., Park, D., Mo, R., Lian, J., Vietzke, D., Coppock, C., Vayshenker, A., Hook, T., Chan, V., Kim, K., Cowley, A., Kim, S., Kaltalioglu, E., Zhang, B., Marokkey, S., Lin, Y., Lee, K., Zhu, H., Weybright, M., Rengarajan, R., Ku, J., Schiml, T., Sudijono, J., Yang, I., Wann, C.

المصدر: IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004. Electron devices meeting Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International. :661-664 2004

Relation: 2004 International Electron Devices Meeting

المؤلفون: Chidambarrao, D., McStay, K., Weybright, M., Mandelman, J., Beintner, J., Li, Y., Crabbe, E.

المصدر: 2003 International Symposium on VLSI Technology, Systems and Applications. Proceedings of Technical Papers. (IEEE Cat. No.03TH8672) VLSI technology, systems and applications VLSI Technology, Systems, and Applications, 2003 International Symposium on. :25-28 2003

Relation: 2003 International Symposium on VLSI Technology, Systems and Applications. Proceedings of Technical Papers

المؤلفون: Rengarajan, R., Weybright, M., Faltermeier, J., Butt, S., Lee, H., Slisher, D., Ronsheim, P., Murphy, C.S., Dellow, M., Divakaruni, R.

المصدر: 29th European Solid-State Device Research Conference Solid-State Device Research Conference, 1999. Proceeding of the 29th European. 1:536-539 1999

Relation: 29th European Solid-State Device Research Conference

المؤلفون: Rupp, T., Chaudhary, N., Dev, K., Fukuzaki, Y., Gambino, J., Ho, H., Iba, J., Ito, E., Kiewra, E., Kim, B., Maldei, M., Matsunaga, T., Ning, J., Rengarajan, R., Sudo, A., Takagawa, Y., Tobben, D., Weybright, M., Worth, G.K., Divakaruni, R., Srinivasan, R., Alsmeier, J., Bronner, G.

المصدر: International Electron Devices Meeting 1999. Technical Digest (Cat. No.99CH36318) Electron devices Electron Devices Meeting, 1999. IEDM '99. Technical Digest. International. :33-36 1999

Relation: International Electron Devices Meeting 1999. Technical Digest

المؤلفون: Seo, K. -I., Haran, B., Gupta, D., Guo, D., Standaert, T., Xie, R., Shang, H., Alptekin, E., Bae, D. -I., Bae, G., Boye, C., Cai, H., Chanemougame, D., Chao, R., Cheng, K., Cho, J., Choi, K., Hamieh, B., Hong, J. G., Hook, T., Jang, L., Jung, J., Jung, R., Lee, D., Lherron, B., Kambhampati, R., Kim, B., Kim, H., Kim, K., Kim, T. S., Ko, S.-B., Lie, F. L., Liu, D., Mallela, H., Mclellan, E., Mehta, S., Montanini, P., Mottura, M., Nam, J., Nam, S., Nelson, F., Ok, I., Park, C., Park, Y., Paul, A., Prindle, C., Ramachandran, R., Sankarapandian, M., Sardesai, V., Scholze, A., Seo, S. -C, Shearer, J., Southwick, R., Sreenivasan, R., Stieg, S., Strane, J., Sun, X., Sung, M. G., Surisetty, C., Tsutsui, G., Tripathi, N., Vega, R., Waskiewicz, C., Weybright, M., Yeh, C.-C., Bu, H., Burns, S., Canaperi, D., Celik, M., Colburn, M., Jagannathan, H., Kanakasabaphthy, S., Kleemeier, W., Liebmann, L., Mcherron, D., Oldiges, P., Paruchuri, V., Spooner, T., Stathis, J., Divakaruni, R., Gow, T., Iacoponi, J., Jenq, J., Sampson, R., Khare, M.

المصدر: 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers VLSI Technology (VLSI-Technology): Digest of Technical Papers, 2014 Symposium on. :1-2 Jun, 2014

Relation: 2014 IEEE Symposium on VLSI Technology

المؤلفون: Divakaruni, R., Weybright, M., Li, Y., Gruening, U., Mandelman, J., Gambino, J., Alsmeier, J., Bronner, G.

المصدر: 1999 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers. (Cat. No.99TH8453) VLSI technology, systems, and applications VLSI Technology, Systems, and Applications, 1999. International Symposium on. :255-257 1999

Relation: Proceedings of International Symposium on VLSI Technology Systems and Applications

المؤلفون: Gambino, J.P., Weybright, M., Faltermeier, J., Domenicucci, A.

المصدر: Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) Interconnect technology Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International. :259-261 1998

Relation: Proceedings of the IEEE 1998 International Interconnect Technology Conference

المؤلفون: Agnello, P., Ivers, T., Warm, C., Wise, R., Wachnik, R., Schepis, D., Sankaran, S., Norum, J., Luning, S., Li, Y., Khare, M., Grill, A., Edelstein, D., Chen, X., Brown, D., Augur, R., Wu, S., Yu, J., Wong, R.C., Werking, J., Wehella-Gamage, D., Vayshenker, A., Van Meer, H., Van Den Nieuwenhuizen, R., Tian, C., Tabakman, K., Sung, C.Y., Standaert, T., Simon, A., Sim, J., Sheraw, C., Restaino, D., Rausch, W., Pal, R., Prindle, C., Ouyang, X., Ouyang, C., Ontalus, V., Nummy, K., Nielsen, D., Nicholson, L., McKnight, A., Lustig, N., Liu, X., Lee, M.H., Lea, D., Larosa, G., Landers, W., Kim, B., Kelling, M., Jeng, S.-J., Holt, J., Hargrove, M., Grunow, S., Greco, S., Gates, S., Frye, A., Fisher, P., Domenicucci, A., Dimitrakopoulos, C., Costrini, G., Chou, A., Cheng, J., Butt, S., Black, L., Belyansky, M., Ahsan, I., Adam, T., Gabor, A., Wu, C.-H.J., Yang, D., Crouse, M., Robinson, C., Corliss, D., Fonseca, C., Johnson, J., Weybright, M., Waite, A., Nayfeh, H.M., Onishi, K., Narasimha, S.

المصدر: 2006 International Electron Devices Meeting Electron Devices Meeting, 2006. IEDM '06. International. :1-4 Dec, 2006

Relation: 2006 International Electron Devices Meeting