المؤلفون: Pasquale, Massimo, Ferrara, Enzo, Banu, Nicoleta, Fiorillo, Fausto, Rocchino, Luciano, Ulvr, Michal, Weickert, Franziska, Pfnuer, Korbinian, Luedke, Joachim, Hoffmann, Katja, Harmon, Stuart, Brunt, Daniel, Wilson, Adam

المصدر: 2024 IEEE International Magnetic Conference - Short papers (INTERMAG Short papers) Magnetic Conference - Short papers (INTERMAG Short papers), 2024 IEEE International. :1-2 May, 2024

Relation: 2024 IEEE International Magnetic Conference - Short Papers (INTERMAG Short Papers)

المؤلفون: Harmon, Stuart, Finch, Graeme, Wilson, Adam

المصدر: 2024 IEEE International Magnetic Conference - Short papers (INTERMAG Short papers) Magnetic Conference - Short papers (INTERMAG Short papers), 2024 IEEE International. :1-2 May, 2024

Relation: 2024 IEEE International Magnetic Conference - Short Papers (INTERMAG Short Papers)

المؤلفون: Cardoso, Anabelle, Hestir, Erin, Slingsby, Jasper, Nesslage, Jacob, Forbes, Cherie, Wilson, Adam

المصدر: IGARSS 2023 - 2023 IEEE International Geoscience and Remote Sensing Symposium Geoscience and Remote Sensing Symposium, IGARSS 2023 - 2023 IEEE International. :499-502 Jul, 2023

Relation: IGARSS 2023 - 2023 IEEE International Geoscience and Remote Sensing Symposium

المؤلفون: Ferguson, Ethan, Wilson, Adam, Naghibijouybari, Hoda

مصطلحات موضوعية: Computer Science - Cryptography and Security, Computer Science - Hardware Architecture

URL الوصول: http://arxiv.org/abs/2401.04349

المؤلفون: Kafka, Judith (ORCID 0000-0003-4120-1602), Wilson, Adam

المصدر: Urban Review: Issues and Ideas in Public Education. Nov 2023 55(4):505-533.

Peer Reviewed: Y

Page Count: 29

Descriptors: School Desegregation, Educational Change, Admission (School), Models, Urban Schools, School Districts, Parent Attitudes, Advantaged, School Choice, Elementary Secondary Education

مصطلحات جغرافية: New York (New York)

المؤلفون: Wilson, Adam A., Fish, Michael C., Hoffman, Robert, Sharar, Darin J.

المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-6 May, 2022

Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

المؤلفون: Sharar, Darin James, Peters, Christopher, Olver, Kimberly, Wilson, Adam, Tsang, Harvey, Altman, David

المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-7 May, 2022

Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

المؤلفون: Nguyen, Sarah, Radice, Joshua, Smith, Andrew, Sharar, Darin, Wilson, Adam, Donovan, Brian, Warzoha, Ronald

المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-6 May, 2022

Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

المؤلفون: Kafka, Judith^{Aff1, IDs11256023006594_cor1}, Wilson, Adam

المصدر: The Urban Review: Issues and Ideas in Education. 55(4):505-533

المؤلفون: Fish, Michael, Wilson, Adam, Hanrahan, Brenden, Pullen, Claude

المصدر: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021 20th IEEE Intersociety Conference on. :301-307 Jun, 2021

Relation: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)